ELECTRONIC STRUCTURE, A BATTERY STRUCTURE, AND A METHOD FOR MANUFACTURING AN ELECTRONIC STRUCTURE

• US 20150084157A1
• Filed: 09/26/2013
• Published: 03/26/2015
• Est. Priority Date: 09/26/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Tegen, Stefan, Lemke, Marko
• Granted Patent: US 9,847,326 B2
• Time in Patent Office: Days
• US Class Current: 257/528
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 21/822 the substrate being a semiconductor, using silicon technology H01L21/8258 takes precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 28/00 Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor testing or measuring during manufacture H01L22/00; integration methods H01L21/70; integrated circuits H01L27/00; two-terminal components with a potential-jump or surface barrier H01L29/00; resistors in general H01C; inductors in general H01F; capacitors in general H01G
• CPC Class Codes: H01L 28/90 having vertical extensions
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01M 10/0436 Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/4257 Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

According to various embodiments, an electronic structure may be provided, the electronic structure may include: a semiconductor carrier, and a battery structure monolithically integrated with the semiconductor carrier, the battery structure including a plurality of thin film batteries.

Claims

1. An electronic structure comprising:

a semiconductor carrier, and

a plurality of thin film batteries monolithically integrated with the semiconductor carrier.

2. The electronic structure of claim 1, further comprising:

a contact structure configured to electrically connect the plurality of thin film batteries with each other;

wherein at least two thin film batteries of the plurality of thin film batteries are electrically coupled in series or in parallel.

3. The electronic structure of claim 1,

wherein each thin film battery of the plurality of thin film batteries comprises a battery layer stack, the battery layer stack comprising at least one solid state electrolyte layer.

4. The electronic structure of claim 3,

wherein the battery layer stack further comprises at least one anode layer adjoining the at least one solid state electrolyte layer and at least one cathode layer adjoining the at least one solid state electrolyte layer.

5. The electronic structure of claim 4,

wherein the battery layer stack further comprises at least one anode current collector layer adjoining the at least one anode layer and at least one cathode current collector layer adjoining the at least one cathode layer.

6. The electronic structure of claim 1,

wherein the carrier comprises a semiconductor wafer.

7. The electronic structure of claim 1,

wherein the carrier comprises a semiconductor chip.

8. The electronic structure of claim 2,

wherein the contact structure comprises a metallization structure.

9. The electronic structure of claim 1, further comprising:

an integrated circuit structure arranged at least one of over and in the carrier, the integrated circuit structure being electrically conductively coupled to the plurality of thin film batteries.

10. The electronic structure of claim 9,

wherein the integrated circuit structure is configured to selectively couple the plurality of thin film batteries to each other and/or to selectively decouple the plurality of thin film batteries from each other.

11. The electronic structure of claim 9,

wherein the integrated circuit structure is configured as a logic circuit.

12. A battery structure comprising:

a plurality of thin film batteries monolithically integrated with a semiconductor carrier, each thin film battery of the plurality of thin film batteries comprises at least one solid state electrolyte layer, at least one anode layer adjoining the at least one solid state electrolyte layer and at least one cathode layer adjoining the at least one solid state electrolyte layer,

a contact structure electrically connecting the plurality of thin film batteries, wherein at least two thin film batteries of the plurality of thin film batteries are electrically coupled to the contacts and to each other.

13. The battery structure of claim 12,

wherein the at least two thin film batteries of the plurality of thin film batteries are electrically coupled to each other in series.

14. The battery structure of claim 12,

wherein the at least two thin film batteries of the plurality of thin film batteries are electrically coupled to each other in parallel.

15. The battery structure of claim 12, further comprising:

at least one anode current collector layer adjoining the at least one anode layer and at least one cathode current collector layer adjoining the at least one cathode layer.

16. The battery structure of claim 12, further comprising:

an integrated circuit structure being electrically coupled to the plurality of thin film batteries and to the contact structure, wherein the integrated circuit structure is configured to selectively couple one or more thin film batteries of the plurality of thin film batteries to each other and/or to selectively decouple one or more thin film batteries of the plurality of thin film batteries from each other.

17. The battery structure of claim 16, further comprising:

a wiring structure switched in the contact structure, the wiring structure comprising one or more switching elements, each of the one or more switching elements being configured to be controlled by the integrated circuit structure, wherein at least one switching element of the one or more switching elements is configured to electrically isolate at least two thin film batteries of the plurality of thin film batteries from each other in a first operating state and to electrically conductively connect the at least two thin film batteries of the plurality of thin film batteries with each other in a second operating state.

18. A method for manufacturing an electronic structure, the method comprising:

providing a semiconductor carrier, and

forming a plurality of thin film batteries monolithically integrated with the semiconductor carrier.

19. The method of claim 18,

wherein forming the plurality of thin film batteries comprises forming a plurality of thin film battery layer stacks.

20. The method of claim 18, further comprising:

forming a contact structure electrically connecting the plurality of thin film batteries with each other;

wherein at least two thin film batteries of the plurality of thin film batteries are electrically coupled in series or in parallel.