METHOD AND CARRIER FOR HANDLING A SUBSTRATE
2 Assignments
0 Petitions
Accused Products
Abstract
There is disclosed a carrier and method for handling and/or transport of a substrate, such as during processing of the substrate, for example, back-thinning. The carrier and method provide support for the substrate. The process is particularly suited to thinning of substrates for use in 3D integrated circuits. The carrier comprises: a contact surface with one or more recesses therein for trapping a volume when the contact surface is brought towards the substrate, the contact surface for supporting the substrate; a sealing surface at the periphery of the contact surface and offset from the contact surface; and the sealing member seating on the sealing surface and arranged to be compressed to form a seal to the substrate when a substrate is in contact with the contact surface, the seal sealing the trapped volume between the substrate and carrier.
15 Citations
95 Claims
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1-76. -76. (canceled)
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77. A carrier for handling and/or transport of a substrate, such as during processing of the substrate, the carrier comprising:
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a contact surface, the contact surface having at least one recess in it, and wherein the recess is for trapping a volume when the contact surface is brought into contact with the substrate, the contact surface for contacting and supporting the substrate; the contact surface comprising a sealing layer, and wherein the sealing layer is arranged to be compressed to form a seal to the substrate when the substrate is in contact with the contact surface, the seal sealing the trapped volume between the substrate and carrier. - View Dependent Claims (78, 79, 80, 81, 82, 83, 84, 85)
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86. A method of handling a substrate for processing, the method comprising:
loading the substrate into a chamber; loading a carrier into the chamber, the carrier having one or more recesses in a contact surface thereof; reducing the pressure in the chamber to a first pressure; moving at least one of the substrate and carrier to bring the contact surface of the carrier into contact with the substrate to trap a volume at the first pressure in the one or more recesses between the carrier and substrate; increasing the pressure in the chamber to a second pressure higher than the first; and wherein the trapped reduced pressure holds the carrier and substrate together for processing. - View Dependent Claims (87, 88, 89, 90, 91, 92, 95)
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93. A method of handling a substrate for processing, the method comprising:
heating a substrate and carrier to a first temperature, the carrier having one or more recesses in a contact surface thereof; moving at least one of the substrate and carrier to bring the contact surface of the carrier into contact with the substrate to trap a volume at the first temperature in the one or more recesses between the carrier and substrate;
holding the substrate and carrier to maintain the trapped volume in the one or more recesses while reducing the temperature of the carrier and substrate to a second temperature, the trapped volume cooling to a reduced pressure; and
releasing the hold on the substrate and carrier, the trapped volume holding the carrier and substrate together for processing.- View Dependent Claims (94)
Specification