LOW-MOISTURE CLOUD-MAKING CLEANING ARTICLE

• US 20150089755A1
• Filed: 09/30/2013
• Published: 04/02/2015
• Est. Priority Date: 09/30/2013
• Status: Active Grant

• Current Assignee: Kimberly-Clark Worldwide Incorporated (Kimberly-Clark Corporation)
• Original Assignee: Kimberly-Clark Worldwide Incorporated (Kimberly-Clark Corporation)
• Inventors: Yang, Kaiyuan, Baker, Andrew T., Feldkamp, Joseph R., Koenig, David William, Lee, WanDuk, Rippl, Carl G., Soerens, Dave A., Abraham, Jose Kollakompil, Engelbrecht, Kathleen C., Leong, Waihong, Bhatt, Divesh, Heo, Jin
• Granted Patent: US 9,826,876 B2
• Time in Patent Office: Days
• US Class Current: 15/104.93
• CPC Class Codes: A47L 13/17 containing cleaning agents A47L13/19 takes precedence ; chemical compositions C11D17/049
• CPC Class Codes: D04H 1/00 Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres

Abstract

A cleaning article includes a cleaning article sheet comprising a fabric substrate, wherein the fabric substrate includes pores therein, and wherein the fabric substrate has a background moisture percentage by weight, and liquid water disposed substantially and disconnectedly within the pores, wherein the liquid water is at moisture percentage by weight that is 5 to 150 percentage points higher than the background moisture percentage. The nonwoven substrate can include pores formed between and/or within the fibers and can have a background moisture percentage by weight. The substrate can include a treatment to increase the dielectric constant from the dielectric constant of the substrate without the treatment. The moisture of the article can be configured to exhibit a dielectric constant of at least 50% and up to 600% higher than the dielectric constant of the same article with only background moisture.

Claims

1. A cleaning article comprising:

a cleaning article sheet comprising a fabric substrate, wherein the fabric substrate includes pores therein, and wherein the fabric substrate has a background moisture percentage by weight; and

liquid water disposed substantially and disconnectedly within the pores, wherein the liquid water is at moisture percentage by weight that is 5 to 150 percentage points higher than the background moisture percentage.

2. The cleaning article of claim 1, wherein the fabric substrate is a nonwoven material having fibers, and wherein the pores are formed between the fibers.

3. The cleaning article of claim 1, wherein the fabric substrate is a nonwoven material having fibers, and wherein the pores are formed within the fibers.

4. The cleaning article of claim 1, wherein the fabric substrate includes cellulosic material.

5. The cleaning article of claim 1, wherein the fabric substrate includes polysaccharide material.

6. The cleaning article of claim 1, wherein the article is configured to transfer liquid water to a surface, and wherein the majority of water transferred to the surface is transferred by condensation.

7. The cleaning article of claim 6, wherein the article is configured to reabsorb a majority of the liquid water transferred to the surface.

8. The cleaning article of claim 1, wherein the moisture of the article is configured to exhibit a dielectric constant of at least 50% and up to 700% higher than the dielectric constant of the same article with only background moisture.

9. The cleaning article of claim 1, wherein the moisture of the article is configured to exhibit a dielectric constant of at least 50% and up to 700% higher than the dielectric constant of the same article with only background moisture, and wherein the article is configured to remove bacteria by establishing a preferred dielectric gradient of ∈

1(wipe)>

∈

2(microbial debris)>

∈

3(surface) during wiping.

10. The cleaning article of claim 1, wherein the substrate includes a treatment to increase the dielectric constant from the dielectric constant of the substrate without the treatment.

11. The cleaning article of claim 10, wherein the treatment includes a zwitterion.

12. The cleaning article of claim 11, wherein the zwitterion is serine.

13. The cleaning article of claim 9, further comprising an alkoxysilane coupling agent.

14. The cleaning article of claim 9, wherein the moisture of the article is configured to exhibit a dielectric constant of at least 50% and up to 700% higher than the dielectric constant of the same article with only background moisture, and wherein the article is configured to remove bacteria by establishing a preferred dielectric gradient of ∈

1(wipe)>

∈

2(microbial debris)>

∈

3(surface) during wiping.

15. A cleaning article comprising:

a cleaning article sheet comprising a nonwoven substrate having fibers, wherein the nonwoven substrate includes pores formed between and/or within the fibers, wherein the nonwoven substrate has a background moisture percentage by weight, and wherein the substrate includes a treatment to increase the dielectric constant from the dielectric constant of the substrate without the treatment; and

liquid water disposed substantially and disconnectedly within the pores, wherein the liquid water is at moisture percentage by weight that is 5 to 150 percentage points higher than the background moisture percentage, and wherein the moisture of the article is configured to exhibit a dielectric constant of at least 50% and up to 600% higher than the dielectric constant of the same article with only background moisture.

16. The cleaning article of claim 15, wherein the treatment includes a zwitterion.

17. The cleaning article of claim 16, wherein the zwitterion is serine.

18. The cleaning article of claim 16, further comprising an alkoxysilane coupling agent.

20. The cleaning article of claim 17, wherein the zwitterion is serine.

19. A cleaning article comprising:

a cleaning article sheet comprising a nonwoven substrate having fibers, wherein the nonwoven substrate includes pores formed between and/or within the fibers;

a treatment on the substrate to increase the dielectric constant from the dielectric constant of the substrate without the treatment, wherein the treatment includes a zwitterion; and

liquid water disposed substantially and disconnectedly within the pores, wherein the liquid water is at moisture percentage by weight that is 5 to 150 percentage points higher than the background moisture percentage, wherein the moisture of the article is configured to exhibit a dielectric constant of at least 50% and up to 600% higher than the dielectric constant of the same article with only background moisture, and wherein the article is configured to remove bacteria by establishing a preferred dielectric gradient of ∈

1(wipe)>

∈

2(microbial debris)>

∈

3(surface) during wiping.