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WAFER LEVEL SEALING METHODS WITH DIFFERENT VACUUM LEVELS FOR MEMS SENSORS

  • US 20150091153A1
  • Filed: 09/30/2013
  • Published: 04/02/2015
  • Est. Priority Date: 09/30/2013
  • Status: Active Grant
First Claim
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1. A wafer level packaging (WLP) structure comprising:

  • a work-piece including a silicon region and including first and second micro-electromechanical system (MEMs) devices thereon;

    first and second cavities-disposed at least partially in the silicon region of the work-piece, and fluidly coupled to the first and second MEMs devices, respectively, wherein the first cavity retains a first pressure level and the second cavity retains a different second pressure level;

    a cap work-piece over the work-piece;

    a gas flow path that couples the second cavity to an opening in the cap work-piece;

    a sealant in the opening in the cap work-piece and sealing the gas flow path from an ambient environment external to the WLP structure; and

    a sealing residue that resides at a bottom surface of the second cavity.

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