INSERT MOLDED PARTS AND METHODS FOR FORMING THE SAME
First Claim
1. A method for forming a composite part having an insert and a molded portion, the method comprising:
- securing the insert within a mold using at least one support mold, the insert having a first surface in contact with the support mold and an exposed second surface;
forming a first part of the molded portion by injecting a first resinous material into the mold, wherein during the injecting, the first resinous material covers the second surface of the insert;
removing the support mold from the first surface of the insert exposing the first surface of the insert and forming a recess within the first part of the molded portion; and
forming a second part of the molded portion by injecting a second resinous material into the recess and over the first surface of the insert such that the first surface and second surface of the insert are encased within the molded portion.
1 Assignment
0 Petitions
Accused Products
Abstract
The embodiments described herein relate to insert molding methods. The methods involve partially or fully encasing an insert within a thermoplastic material, forming a composite part that includes the insert and the molded thermoplastic material. Methods described provide a number of improvements over traditional insert molding techniques. In specific embodiments, a two-shot molding process is used whereby a first shot is formed on a first portion of the insert and a second shot is formed on a second portion of the insert. The insert molding processes can be performed using a single mold during the first and second injection molding processes.
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Citations
20 Claims
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1. A method for forming a composite part having an insert and a molded portion, the method comprising:
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securing the insert within a mold using at least one support mold, the insert having a first surface in contact with the support mold and an exposed second surface; forming a first part of the molded portion by injecting a first resinous material into the mold, wherein during the injecting, the first resinous material covers the second surface of the insert; removing the support mold from the first surface of the insert exposing the first surface of the insert and forming a recess within the first part of the molded portion; and forming a second part of the molded portion by injecting a second resinous material into the recess and over the first surface of the insert such that the first surface and second surface of the insert are encased within the molded portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A composite part, comprising:
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an insert having a first surface and a second surface; and a molded piece formed using an injection molding process, the molded piece comprising; a first molded portion molded onto the second surface of the insert, a second molded portion molded onto the first surface of the insert and onto at least a section of the first molded portion, and an indentation disposed within the first molded portion, the indentation formed during the injection molding process. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. An electronic device, comprising:
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a printed circuit board having a first surface and a second surface; and a molded piece at least partially encasing the printed circuit board therein, the molded piece formed using a molding process, the molded piece comprising; a first molded portion disposed on the second surface of the printed circuit board, a second molded portion disposed on the first surface of the printed circuit board and disposed on at least a section of the first molded portion, and an indentation disposed within the first molded portion, the indentation formed during the molding process. - View Dependent Claims (18, 19, 20)
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Specification