Methods for Controlling Warpage in Packaging
First Claim
Patent Images
1. A method comprising:
- placing a plurality of dummy dies over a carrier;
placing a plurality of device dies over the carrier;
molding the plurality of dummy dies and the plurality of device dies in a molding compound;
forming redistribution line over and electrically coupled to the device dies; and
performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
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Abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
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Citations
20 Claims
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1. A method comprising:
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placing a plurality of dummy dies over a carrier; placing a plurality of device dies over the carrier; molding the plurality of dummy dies and the plurality of device dies in a molding compound; forming redistribution line over and electrically coupled to the device dies; and performing a die-saw to separate the device dies and the molding compound into a plurality of packages. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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placing a plurality of dummy dies on a die-attach film, wherein the die-attach film is further overlying a carrier; placing a plurality of device dies on the die-attach film, wherein the plurality of dummy dies overlaps a peripheral region of the carrier, and wherein the plurality of device dies overlaps an inner region of the carrier; molding the plurality of dummy dies and the plurality of device dies in a molding compound to form a composite wafer, wherein the plurality of dummy dies has a Coefficient of Thermal Expansion (CTE) smaller lower than a CTE of the molding compound; forming redistribution lines over and electrically coupled to the plurality of device dies; demounting the composite wafer from the carrier; and performing a die-saw to separate the composite wafer into a plurality of packages, wherein each of the plurality of packages comprises one of the device dies, and is free from dummy dies therein. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
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placing a plurality of dummy dies in recesses of a mold; picking up the plurality of dummy dies simultaneously using a vacuum suction plate, wherein the vacuum suction plate comprises a plurality of holes, each aligned to one of the plurality of dummy dies during the picking up; releasing the plurality of dummy dies picked up by the vacuum suction plate onto a die-attach film, wherein the die-attach film is laminated on a carrier, and wherein the plurality of dummy dies is distributed overlapping peripheral regions of the carrier, with an inner region of the carrier encircled by the peripheral region free from overlying dummy dies; placing a plurality of device dies overlapping the inner region of the carrier; molding the plurality of dummy dies and the plurality of device dies in a molding compound to form a composite wafer; forming redistribution lines over and electrically coupled to the plurality of device dies; and performing a die-saw to separate the composite wafer into a plurality of packages. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification