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Methods for Controlling Warpage in Packaging

  • US 20150093858A1
  • Filed: 09/27/2013
  • Published: 04/02/2015
  • Est. Priority Date: 09/27/2013
  • Status: Active Grant
First Claim
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1. A method comprising:

  • placing a plurality of dummy dies over a carrier;

    placing a plurality of device dies over the carrier;

    molding the plurality of dummy dies and the plurality of device dies in a molding compound;

    forming redistribution line over and electrically coupled to the device dies; and

    performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

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