Methods for Controlling Warpage in Packaging

• US 20150093858A1
• Filed: 09/27/2013
• Published: 04/02/2015
• Est. Priority Date: 09/27/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hwang, Chien Ling, Jang, Bor-Ping, Liao, Hsin-Hung, Lin, Yeong-Jyh, Liu, Chung-Shi, Liang, Hsiao-Chung
• Granted Patent: US 9,093,337 B2
• Time in Patent Office: Days
• US Class Current: 438/113
• CPC Class Codes: H01L 21/31051 Planarisation of the insulating layers H01L21/31058 takes precedence
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/0231 Manufacturing methods of the redistribution layers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/1146 Plating
• CPC Class Codes: H01L 2224/11849 Reflowing
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

Claims

1. A method comprising:

placing a plurality of dummy dies over a carrier;

placing a plurality of device dies over the carrier;

molding the plurality of dummy dies and the plurality of device dies in a molding compound;

forming redistribution line over and electrically coupled to the device dies; and

performing a die-saw to separate the device dies and the molding compound into a plurality of packages.

2. The method of claim 1, wherein the plurality of packages is free from dummy dies therein.

3. The method of claim 1, wherein the plurality of device dies is placed overlapping an inner area of the carrier, and wherein the plurality of dummy dies is placed overlapping a peripheral area of the carrier, with the peripheral area encircling the inner area, and wherein none of the plurality of dummy dies is placed to overlap the inner area.

4. The method of claim 1, wherein the placing the plurality of dummy dies comprises picking up the plurality of dummy dies one by one, and placing the plurality of dummy dies over the carrier one by one.

5. The method of claim 1, wherein the placing the plurality of dummy dies comprises:

placing the plurality of dummy dies in recesses of a mold; and

transferring the plurality of dummy dies over the carrier, wherein relative positions of the plurality of dummy dies on the carrier are same as relative positions of the plurality of dummy dies in the recesses of the mold.

6. The method of claim 5, wherein the transferring the plurality of dummy dies comprises:

simultaneously picking up the plurality of dummy dies from the mold using a vacuum suction plate; and

simultaneously placing the plurality of dummy dies over the carrier.

7. The method of claim 5, wherein the transferring the plurality of dummy dies comprises:

heating the mold and plurality of dummy dies; and

contacting the plurality of dummy dies to an adhesive die-attach film, wherein the adhesive die-attach film is laminated on the carrier.

8. A method comprising:

placing a plurality of dummy dies on a die-attach film, wherein the die-attach film is further overlying a carrier;

placing a plurality of device dies on the die-attach film, wherein the plurality of dummy dies overlaps a peripheral region of the carrier, and wherein the plurality of device dies overlaps an inner region of the carrier;

molding the plurality of dummy dies and the plurality of device dies in a molding compound to form a composite wafer, wherein the plurality of dummy dies has a Coefficient of Thermal Expansion (CTE) smaller lower than a CTE of the molding compound;

forming redistribution lines over and electrically coupled to the plurality of device dies;

demounting the composite wafer from the carrier; and

performing a die-saw to separate the composite wafer into a plurality of packages, wherein each of the plurality of packages comprises one of the device dies, and is free from dummy dies therein.

9. The method of claim 8, wherein the plurality of dummy dies has sizes different from each other.

10. The method of claim 8, wherein the carrier comprises a glass carrier, and wherein the plurality of dummy dies comprises glass dies.

11. The method of claim 8, wherein the placing the plurality of dummy dies comprises:

placing the plurality of dummy dies in recesses of a mold; and

transferring the plurality of dummy dies onto the die-attach film, wherein relative positions of the plurality of dummy dies on the die-attach film are same as relative positions of the plurality of dummy dies in the recesses of the mold.

12. The method of claim 11, wherein the placing the plurality of dummy dies in the recesses comprises:

pouring the plurality of dummy dies over the mold; and

vibrating the mold and the plurality of dummy dies.

13. The method of claim 11, wherein the transferring the plurality of dummy dies comprises:

simultaneously picking up the plurality of dummy dies using a vacuum suction plate; and

simultaneously placing the plurality of dummy dies over the carrier.

14. The method of claim 11, wherein the transferring the plurality of dummy dies comprises:

heating the mold and the plurality of dummy dies; and

contacting the plurality of dummy dies to the die-attach film.

15. A method comprising:

placing a plurality of dummy dies in recesses of a mold;

picking up the plurality of dummy dies simultaneously using a vacuum suction plate, wherein the vacuum suction plate comprises a plurality of holes, each aligned to one of the plurality of dummy dies during the picking up;

releasing the plurality of dummy dies picked up by the vacuum suction plate onto a die-attach film, wherein the die-attach film is laminated on a carrier, and wherein the plurality of dummy dies is distributed overlapping peripheral regions of the carrier, with an inner region of the carrier encircled by the peripheral region free from overlying dummy dies;

placing a plurality of device dies overlapping the inner region of the carrier;

molding the plurality of dummy dies and the plurality of device dies in a molding compound to form a composite wafer;

forming redistribution lines over and electrically coupled to the plurality of device dies; and

performing a die-saw to separate the composite wafer into a plurality of packages.

16. The method of claim 15 further comprising, during the releasing the plurality of dummy dies, heating the die-attach film.

17. The method of claim 15, wherein the placing the plurality of dummy dies in the recesses comprises:

pouring the plurality of dummy dies over the mold; and

vibrating the mold and the plurality of dummy dies.

18. The method of claim 15, wherein the plurality of dummy dies has a Coefficient of Thermal Expansion (CTE) smaller lower than a CTE of the molding compound.

19. The method of claim 18, wherein the plurality of dummy dies comprises glass dies.

20. The method of claim 18, wherein the redistribution lines extend beyond edges of the respective underlying ones of the plurality of device dies.