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COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE

  • US 20150097210A1
  • Filed: 10/08/2014
  • Published: 04/09/2015
  • Est. Priority Date: 10/09/2013
  • Status: Active Grant
First Claim
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1. A method for fabricating a composite device used for photonics, the method comprising:

  • providing a platform, the platform comprising;

    a base layer;

    a device layer above the base layer of the platform, wherein the device layer comprises a plurality of walls forming an opening in the device layer such that a portion of the base layer of the platform is exposed through the device layer;

    providing a chip, the chip comprising;

    a substrate; and

    an active region;

    bonding the chip to the portion of the base layer of the platform.

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