×

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL CAPPING LAYERS

  • US 20150097292A1
  • Filed: 12/12/2014
  • Published: 04/09/2015
  • Est. Priority Date: 06/03/2005
  • Status: Active Grant
First Claim
Patent Images

1. A method of fabricating an interconnect structure, comprising:

  • providing an interconnect including a conductive material extending into a dielectric material layer;

    forming capping layer proximate said interconnect; and

    forming a sealing structure to seal at least one gap of exposed interconnect conductive material between said capping layer and said dielectric layer.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×