PIEZOELECTRIC ULTRASONIC TRANSDUCER ARRAY WITH SWITCHED OPERATIONAL MODES

• US 20150097468A1
• Filed: 10/03/2013
• Published: 04/09/2015
• Est. Priority Date: 10/03/2013
• Status: Active Grant

• Current Assignee: Fujifilm Dimatix, Inc. (Fujifilm Holdings Corporation)
• Original Assignee: Arman Hajati
• Inventors: Hajati, Arman, Gardner, Dean
• Granted Patent: US 9,475,093 B2
• Time in Patent Office: Days
• US Class Current: 310/334
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: H10N 30/1071 with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
• CPC Class Codes: H10N 30/2048 having non-planar shape

Abstract

Switchable micromachined transducer arrays are described where one or more switches, or relays, are monolithically integrated with transducer elements in a piezoelectric micromachined transducer array (pMUT). In embodiments, a MEMS switch is implemented on the same substrate as the transducer array for switching operational modes of the transducer array. In embodiments, a plurality of transducers are interconnected in parallel through MEMS switch(es) in a first operational mode (e.g., a drive mode) during a first time period, and are then interconnected through the MEMS switch(es) with at least some of the transducers in series in a second operational mode (e.g., a sense mode) during a second time period.

Claims

1. A micromachined transducer array, comprising:

a transducer substrate;

a plurality of transducers disposed over the transducer substrate; and

one or more switches disposed over the transducer substrate, wherein the one or more switches are electrically switchable between a first state and second state, the first state interconnecting at least two transducers of the plurality in electrical parallel, and the second state interconnecting the at least two transducers in electrical series.

2. The transducer array of claim 1, wherein the one or more switches comprise one or more MEMS switches.

3. The transducer array of claim 1, wherein the first state places all transducers of the plurality in parallel, and the second state places a first subset of the plurality in series with a second subset of the plurality.

4. The transducer array of claim 3, wherein the first subset includes a plurality of transducers connected in electrical parallel and the second subset includes a plurality of transducers connected in electrical parallel.

5. The transducer array of claim 3, wherein the plurality of transducers comprise one channel of a multi-channeled array with each channel of the array including the same number of transducers, and each channel of the array switchable between the first state having all transducers of each channel in parallel and the second state having the first subset of each channel in series with the second subset of each channel.

6. The transducer array of claim 5, wherein the one or more switches comprise MEMS switches each associated with respective channel of the array and wherein all of the first MEMS switches are coupled to a single control signal line that is to concurrently set all channels of the array into the first or second state.

7. The transducer array of claim 6, wherein the MEMS switches comprise a piezoelectric, electrostatic or electromagnetic switching member, and wherein the plurality of transducers are resonant within the ultrasonic frequency band.

8. The transducer array of claim 7, wherein each of the plurality of transducers comprises a piezoelectric material and wherein the one or more MEMS switch comprises a piezoelectric member employing a same piezoelectric material as the plurality of transducers.

9. The transducer array of claim 8, wherein the MEMS switches comprise a capacitive switch comprising a cantilever or fixed beam further comprising the piezoelectric material.

10. The transducer array of claim 6, wherein the MEMS switches comprise:

a first MEMS switch connected in series between a ground electrode of a first transducer and a drive electrode of a second transducer;

a second MEMS switch connected between a drive electrode of the first transducer and the drive electrode of the second transducer;

a third MEMS switch connected between the ground electrode of the first transducer and a ground electrode of the second transducer;

a fourth MEMS switch and a fifth MEMS switch connected in series with one another between the ground electrode of the first transducer and the ground electrode of the second transducer, the first and fifth MEMS switches coupled to one or more switch controllers to actuate into same open or closed states, the second, third and fourth MEMS switches coupled to the one or more switch controllers to actuate with the first and fifth MEMS switches, but in open or closed states that are complementary to those of the first and fifth MEMS switches.

11. The transducer array of claim 6, wherein the MEMS switches comprise:

a first MEMS switch connected between a drive electrode of a first transducer and a drive electrode of a second transducer;

a second MEMS switch and a third MEMS switch connected in series with one another between the drive electrode of the second transducer and a node coupling respective ground electrodes of the first and second transducers, the first and second MEMS switches coupled to one or more switch controllers to actuate into same open or closed states, the third MEMS switch coupled to the one or more switch controllers to actuate with the first and second MEMS switches, but in an open or closed state that is complementary to those of the first and second MEMS switches.

12. The transducer array of claim 10, wherein the one or more switch controllers comprise additional MEMS switches disposed over the transducer substrate or CMOS transistors disposed over a CMOS substrate.

13. An apparatus for generating and sensing pressure waves in a medium, the apparatus comprising:

the transducer array of claim 1;

one or more signal generators coupled to the transducer array to apply an electrical drive signal on a first drive/sense channel;

one or more receivers coupled to the transducer array to receive an electrical response signal from the first drive/sense channel;

one or more switch controllers connected to at least a first of the MEMS switches to couple different ones of the piezoelectric transducers in series or parallel configuration over time; and

at least one signal processor coupled to the receiver to process a plurality of electrical response signals received from the drive/sense channel into an image.

14. The apparatus of claim 13, wherein the one or more signal generators are to apply an electrical drive signal to transducers connected in parallel through the one or more MEMS switches.

15. The apparatus of claim 14, wherein the one or more receivers are coupled to collect an electrical sense signal from transducers connected in series through the one or more MEMS switches.

16. The apparatus of claim 15, wherein the transducers are driven by the one or more generators to resonate at frequencies between 1 MHz and 50 MHz, wherein the transducers connected in series further comprise a first subset of the plurality in series with a second subset of the plurality, and wherein transducers within the first subset are connected in electrical parallel and transducers within the second subset are connected in electrical parallel.

18. A method of generating and sensing pressure waves in a medium, the method comprising:

connecting a plurality of micromachined transducers of a transducer array disposed over a transducer substrate in electrical parallel during a first time period through one or more switches set to a first state;

driving the plurality of transducers with an electrical signal during the first time period;

reconnecting at least some of the transducers in electrical series during a second time period by setting the one or more switches to a second state; and

receiving an electrical response signal from the plurality of transducers during the second time period.

19. The method of claim 18, wherein the connecting further comprises sending one or more first control signals to the one or more switches to set the first state, and wherein the reconnecting further comprises sending one or more second control signals to the one or more switches to set the second state.

20. The method of claim 19, wherein the transducer array comprises a plurality of channels, with each channel including a plurality of transducers, and wherein sending the one or more first and second control signals further comprises sending the same first and second control signals to MEMS switches in each of the plurality of channels concurrently.

21. The method of claim 19, wherein the transducers comprise a piezoelectric material, and wherein sending the one or more first control signals comprises applying a voltage to an electrode coupled to a piezoelectric member of a first MEMS switch sufficient to short circuit or capacitively couple poles of the first MEMS switch, wherein the first MEMS switch is coupled between respective electrodes of two transducers.