HEAT DISSIPATION DEVICE AND A METHOD FOR MANUFACTURING SAME

• US 20150101785A1
• Filed: 10/13/2014
• Published: 04/16/2015
• Est. Priority Date: 10/12/2013
• Status: Abandoned Application

• Current Assignee: Garuda Technology Co., Ltd., Fukui Precision Component Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Fukui Precision Component Company Limited (Hon Hai Precision Industry Co., Ltd.), Zhen Ding Technology Co. Ltd
• Inventors: HO, MING-JAAN, HU, XIAN-QIN, SHEN, FU-YUN
• Application Number:
  US14/512,546
• Publication Number:
  US 20150101785A1
• Time in Patent Office: Days
• US Class Current: 165/170
• CPC Class Codes: B21D 53/04 of sheet metal
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28F 21/085 from copper or copper alloys
• CPC Class Codes: F28F 2275/025 by using adhesives
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

Claims

1. A heat dissipation device comprising:

a first copper sheet comprising a plurality of first recesses;

a second copper sheet comprising a plurality of second recesses, the second recesses corresponding with the first recesses, the second copper sheet being fixed on the first copper sheet and each the second recesses facing the corresponding first recesses, an airtight receiving cavity being formed by each of the first recesses and the second recesses, the second copper sheet being fixed on the first copper sheet with adhesive, the adhesive forms a part of an inner wall of the airtight receiving cavity; and

a working fluid received in the airtight receiving cavity.

2. The heat dissipation device of claim 1, wherein the first copper sheet comprises a first surface, the second copper sheet comprises a second surface facing the first surface, the first recesses are randomly distributed on the first surface.

3. The heat dissipation device of claim 2, wherein the first copper sheet comprises a plurality of first ribs, the first ribs are formed between each two adjacent first recesses, the second copper sheet comprises a plurality of second ribs, the second ribs are formed between each two adjacent second recesses, the first ribs are corresponding with the second ribs.

4. The heat dissipation device of claim 1, wherein the adhesive is low temperature solder paste.

5. The heat dissipation device of claim 4, wherein the adhesive comprises a molten resin material doped with metal particles, the metal particle is selected from the group comprising tin, bismuth and any combination thereof.

6. The heat dissipation device of claim 5, wherein a weight ratio of tin in the adhesive is in the range from about 37% to about 38%, a weight ratio of bismuth in the adhesive is in the range from about 51% to about 52%, and a weight ratio of molten resin in the adhesive is in the range from about 4% to about 6%.

7. The heat dissipation device of claim 3, wherein the adhesive is sandwiched between the first ribs and the second ribs.

8. The heat dissipation device of claim 1, wherein a cross section of the first and second recesses is an arc or a semi circle.

9. A heat dissipation device, comprising:

a first copper sheet comprising a plurality of first recesses;

a second copper sheet comprising a plurality of second recesses, the second recesses being corresponding with the first recesses, the second copper sheet being fixed on the first copper sheet such that each of the second recesses mate with the corresponding first recesses to define a plurality of an airtight receiving cavities being formed by each the first recess and the second recess; and

a working fluid in each of the airtight receiving cavities;

wherein the first and second copper sheets are configured to transmit external heat from an outer surface toward the working fluid, thereby providing a heat sink.

11. The method of claim 9, wherein the a depth of each first recesses is smaller than a thickness of the first copper sheet, a depth of each second recesses is smaller than a thickness of the second copper sheet.

10. A method for manufacturing the heat dissipation device, the method comprising:

providing a first copper base and a second copper base, the first copper base comprises a first surface, the second copper base comprises a second surface facing toward the first surface;

processing the first surface to form a number of first recess and a number of ribs between each two adjacent first recesses,

processing the second surface to form a number of second recesses, the second recesses and the first recesses have the same shape and size;

providing an adhesive on the ribs of the first copper sheet;

providing a working fluid in the first recesses of the first copper sheet;

pressing the second copper sheet on the adhesive, and the second copper sheet is fixed with the first copper sheet by the adhesive, each the first recesses are in communication with the second recesses, each of the first recesses and the second recesses together form an airtight receiving cavity;

solidifying the adhesive.

12. The method of claim 10, wherein the adhesive is low temperature solder paste.

13. The method of claim 12, wherein the adhesive comprises of molten resin material doped with metal particles, the metal particle is selected from the group comprising tin, bismuth and any combination thereof.

14. The method of claim 13, wherein a weight ratio of tin in the adhesive is in the range from about 37% to about 38%, a weight ratio of bismuth in the adhesive is in the range from about 51% to about 52%, and a weight ratio of molten resin in the adhesive is in the range from about 4% to about 6%.

15. The method of claim 13, wherein the working fluid at least is able to select from the group comprising water, methanol, ethanol, acetone, ammonia, paraffin, oil, and chlorofluorocarbons.