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MIXED ABRASIVE POLISHING COMPOSITIONS

  • US 20150102012A1
  • Filed: 10/10/2013
  • Published: 04/16/2015
  • Est. Priority Date: 10/10/2013
  • Status: Active Grant
First Claim
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1. A chemical-mechanical polishing composition comprising:

  • (a) first abrasive particles, wherein the first abrasive particles are ceria particles, and wherein the first abrasive particles have an average particle size of about 30 nm to about 1 μ

    m and are present in the polishing composition at a concentration of about 0.005 wt. % to about 2 wt. %,(b) second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, and wherein the second abrasive particles have an average particle size of about 1 nm to about 60 nm and are present in the polishing composition at a concentration of about 0.005 wt. % to about 2 wt. %,(c) a functionalized pyridine, benzoic acid, amino acid, or combination thereof,(d) a pH-adjusting agent, and(e) an aqueous carrier,wherein the polishing composition exhibits a multimodal particle size distribution, andwherein the pH of the polishing composition is about 3.5 to about 9.

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