SILVER COMPOUND, SILVER INK AND METHOD FOR INKJET PRINTING ON FLEXIBLE SUBSTRATE USING THE SAME

• US 20150102272A1
• Filed: 06/02/2014
• Published: 04/16/2015
• Est. Priority Date: 10/16/2013
• Status: Active Grant

• Current Assignee: National Sun Yat-sen University
• Original Assignee: National Sun Yat-sen University
• Inventors: DONG, Teng-yuan, Chen, Chen-Ni
• Granted Patent: US 9,388,055 B2
• Time in Patent Office: Days
• US Class Current: 252/519.21
• CPC Class Codes: B05D 5/12 to obtain a coating with specific electrical properties
• CPC Class Codes: C01G 5/006 Compounds containing, besides silver, two or more other elements, with the exception of oxygen or hydrogen
• CPC Class Codes: C09D 11/36 based on non-aqueous solvents
• CPC Class Codes: C09D 11/52 Electrically conductive inks
• CPC Class Codes: H01B 1/02 mainly consisting of metals or alloys
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence

Abstract

A silver compound having a silver complex structure composed of silver ion, 2,2,6,6-tetramethyl-3,5-heptanedionato, and diethylenetriamine is disclosed. A silver ink is prepared by the silver compound applied for inkjet printing of a flexible substrate. A method for inkjet printing of the flexible substrate comprises the steps of pre-heating the flexible substrate to the temperature of 60° C., inkjet printing the flexible substrate with the silver ink thereon, and heating the flexible substrate under a low temperature to form a thin film of silver conductive pattern thereon. The silver conductive pattern has excellent electrical conductivity and a resistance value proximate to that of a general silver slug.

Claims

1. A silver compound having the structure given in the following formula (I):

2. A silver ink for forming a conductive pattern on a flexible substrate, comprising the silver compound according to claim 1, n-hexylamine, and a thickener.

3. The silver ink according to claim 2, wherein the thickener is ethyl cellulose.

4. The silver ink according to claim 2, wherein the silver ink is applied on the flexible substrate by spin-coating.

5. The silver ink according to claim 4, wherein the weight ratio of the silver compounds, n-hexylamine, and the thickener is 60:

39;

1.

6. The silver ink according to claim 2, wherein the silver ink is applied on the flexible substrate by spraying.

7. The silver ink according to claim 6, wherein the weight ratio of the silver compounds, n-hexylamine, and the thickener is 45:

54;

1.

8. The silver ink according to claim 2, wherein the material of the flexible substrate is selected from polyimide, polyether sulfone, polyethylene terephthalate, or flexible foil.

9. A method for inkjet printing on a flexible substrate, comprising the steps of:

heating the flexible substrate to 60°

C.;

printing the silver ink according to claim 2 to form a conductive pattern on the flexible substrate; and

heating the flexible substrate in the air to a predetermined temperature so that the silver compound is reduced to form a thin film of silver conductive pattern.

10. The method according to claim 9, wherein the material of the flexible substrate is selected from polyimide, polyethersulfone, polyethylene terephthalate, or flexible foil.

11. The method according to claim 9, wherein the predetermined temperature is between 150 and 250°

C.

12. The method according to claim 9, wherein the silver ink is applied on the flexible substrate by spin-coating or piezo inkjet printing.