LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• US 20150102373A1
• Filed: 06/25/2014
• Published: 04/16/2015
• Est. Priority Date: 10/10/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Yong Tae, Lee, Seung Jae, Hwang, Seong Deok, Lee, Sang Hyun, Kam, Dong Hyuck, Yong, Gam Han
• Application Number:
  US14/314,650
• Publication Number:
  US 20150102373A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material and having an upwardly inclined surface. The LED package also includes a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.

Claims

1. A light emitting diode (LED) package comprising:

a package body;

an LED chip mounted on the package body;

a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material, and having an upwardly inclined surface; and

a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.

2. The LED package of claim 1, wherein the inclined surface extends from an edge of the top surface of the LED chip to a mounting surface of the package body.

3. The LED package of claim 1, wherein the inclined surface is curved.

4. The LED package of claim 3, wherein the inclined surface is concavely curved with respect to a straight line connecting an edge of the top surface of the LED chip to a mounting surface of the package body.

5. The LED package of claim 3, wherein the inclined surface is convexly curved with respect to a straight line connecting an edge of the top surface of the LED chip to a mounting surface of the package body.

6. The LED package of claim 1, wherein the side inclined portion extends to have a flat surface on the same level as the top surface of the LED chip.

7. The LED package of claim 1, wherein the light transmission material is a transparent resin.

8. The LED package of claim 7, wherein the transparent resin is selected from the group consisting of a silicon resin, a modified silicon resin, an epoxy resin, a urethane resin, an oxetane resin, an acrylic resin, a polycarbonate resin, a polyimide resin, and a combination thereof.

9. The LED package of claim 1, wherein the wavelength conversion layer has a substantially uniform thickness.

10. The LED package of claim 1, further comprising a lens unit sealing the wavelength conversion layer.

11. An LED package comprising:

a package body including a first electrode structure and a second electrode structure;

an LED chip having a first electrode and a second electrode disposed on one surface thereof and mounted on the first electrode structure and the second electrode structure of the package body;

a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material, and having an upwardly inclined surface; and

a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.

12. The LED package of claim 11, wherein the inclined surface extends from an edge of the top surface of the LED chip to a mounting surface of the package body.

13. The LED package of claim 11, wherein the inclined surface is concavely curved with respect to a straight line connecting an edge of the top surface of the LED chip to a mounting surface of the package body.

14. The LED package of claim 11, wherein the inclined surface is convexly curved with respect to a straight line connecting an edge of the top surface of the LED chip to a mounting surface of the package body.

15. A method of manufacturing an LED package, the method comprising:

mounting an LED chip on a mounting surface of a package body;

applying a transparent resin to side surfaces of the LED chip to enclose the side surfaces and form a side inclined portion having an inclined surface extending from an edge of a top surface of the LED chip to the mounting surface of the package body; and

forming a wavelength conversion layer to cover the top surface of the LED chip and the inclined surface of the side inclined portion.

16. The method of claim 15, wherein the forming of the wavelength conversion layer is performed by conformally coating a wavelength conversion material.

17. The method of claim 15, further comprising:

curing the applied transparent resin; and

removing a portion of the cured transparent resin to expose the top surface of the LED chip.

18. The method of claim 15, further comprising forming a lens unit to seal the wavelength conversion layer.

19. The method of claim 15, wherein the package body includes a first electrode structure and a second electrode structure, and

wherein the LED chip includes a first electrode and a second electrode disposed on one surface thereof, and

wherein the mounting of the LED chip on the mounting surface of the package body is performed by respectively mounting the first electrode and the second electrode on the first electrode structure and the second electrode structure.

20. The method of claim 15, wherein the inclined surface is curved.