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FLIP CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE

  • US 20150102377A1
  • Filed: 10/14/2014
  • Published: 04/16/2015
  • Est. Priority Date: 10/14/2013
  • Status: Abandoned Application
First Claim
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1. A flip chip light emitting diode package structure, comprising:

  • a package carrier;

    a light guiding unit, disposed on the package carrier; and

    at least one light emitting unit, disposed on the package carrier, and located between the light guiding unit and the package carrier, wherein a horizontal projection area of the light guiding unit is greater than a horizontal projection area of the light emitting unit, the light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit.

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