FLIP CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
First Claim
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1. A flip chip light emitting diode package structure, comprising:
- a package carrier;
a light guiding unit, disposed on the package carrier; and
at least one light emitting unit, disposed on the package carrier, and located between the light guiding unit and the package carrier, wherein a horizontal projection area of the light guiding unit is greater than a horizontal projection area of the light emitting unit, the light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit.
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Abstract
A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding unit and the light emitting unit are disposed on the package carrier, and the light emitting unit is located between the light guiding unit and the package carrier. A horizontal projection area of the light guiding unit is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit.
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Citations
22 Claims
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1. A flip chip light emitting diode package structure, comprising:
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a package carrier; a light guiding unit, disposed on the package carrier; and at least one light emitting unit, disposed on the package carrier, and located between the light guiding unit and the package carrier, wherein a horizontal projection area of the light guiding unit is greater than a horizontal projection area of the light emitting unit, the light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification