MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING AND METHOD OF FABRICATION

• US 20150102437A1
• Filed: 10/14/2013
• Published: 04/16/2015
• Est. Priority Date: 10/14/2013
• Status: Abandoned Application

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Liu, Lianjun, Monk, David J., Bates, James S., Chowdhury, Mamur, Taheri, Babak A.
• Application Number:
  US14/053,236
• Publication Number:
  US 20150102437A1
• Time in Patent Office: Days
• US Class Current: 257/419
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 1/00198 comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01L 1/142 using capacitors
• CPC Class Codes: G01L 1/246 using integrated gratings, e.g. Bragg gratings
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01P 15/125 by capacitive pick-up

Abstract

A device (20) includes sensors (30, 32, 34) that sense different physical stimuli. Fabrication (90) entails forming (92) a device structure (22) to include the sensors and coupling (150) a cap structure (24) with the device structure so that the sensors are interposed between the cap structure and a substrate layer (28) of the device structure. Fabrication (90) further entails forming ports (38, 40) in the substrate layer (28) such that one port (38) exposes a sense element (44) of the sensor (30) to an external environment (72), and another port (40) temporarily exposes the sensor (34) to the external environment. A seal structure (26) is attached to the substrate layer (28) such that one port (40) is hermetically sealed by the seal structure and an external port (46) of the seal structure is aligned with the port (38).

Claims

1. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:

forming a first structure having a substrate layer, a first sensor, and a second sensor, said first and second sensors being positioned on a first side of said substrate layer, and said second sensor being laterally spaced apart from said first sensor;

coupling a second structure with said first structure such that said first and second sensors are interposed between said substrate layer and said second structure;

forming a first port and a second port in a second side of said substrate layer, said first port extending through said substrate layer to expose a sense element of said first sensor to an external environment, and said second port extending through said substrate layer to temporarily expose said second sensor to said external environment; and

attaching a third structure to said second side of said substrate layer such that said second port is hermetically sealed by said third structure and an external port of said third structure is aligned with said first port.

2. A method as claimed in claim 1 wherein said second structure includes a third side and a fourth side, and said method further comprises forming a conductive via extending through said second structure from said third side to said fourth side.

3. A method as claimed in claim 2 further comprising forming a conductive interconnect on said third side of said second structure, said conductive interconnect being in electrical communication with said conductive via.

4. A method as claimed in claim 2 wherein said coupling operation comprises utilizing a conductive bonding layer to form a conductive interconnection between said second structure and said first structure, wherein said conductive via is electrically coupled with said conductive bonding layer.

5. A method as claimed in claim 1 wherein said coupling operation produces at least one hermetically sealed cavity in which said first and second sensors are located.

6. A method as claimed in claim 5 wherein said at least one cavity includes a first cavity and a second cavity, said second cavity being physically isolated from said first cavity, and wherein said first sensor is located in said first cavity and said second sensor is located in said second cavity.

7. A method as claimed in claim 6 further comprising producing said first cavity to have a first cavity pressure that is different from a second cavity pressure of said second cavity.

8. A method as claimed in claim 6 wherein:

said first sensor is a pressure sensor, and said sense element is a diaphragm interposed between said first cavity and said first port, said diaphragm is exposed to said external environment via said first port and said external port, said diaphragm being movable in response to a pressure stimulus from said external environment; and

said second sensor is an inertial sensor having a movable element, said second sensor being adapted to sense a motion stimulus as movement of said movable element.

9. A method as claimed in claim 1 wherein said attaching operation is performed following said coupling operation.

10. A method as claimed in claim 9 wherein said coupling operation is performed under vacuum conditions to produce a first cavity in which said first sensor is located.

11. A method as claimed in claim 1 wherein said first structure further includes a third sensor positioned on said first side of said substrate layer and laterally spaced apart from said first and second sensors.

12. A method as claimed in claim 11 wherein:

said first sensor comprises a pressure sensor, said sense element is a diaphragm interposed between a first cavity and said first port, said diaphragm is exposed to said external environment via said first port and said external port, said diaphragm being movable in response to a pressure stimulus from said external environment;

said second sensor comprises an accelerometer having a first movable element, said accelerometer being adapted to sense an acceleration stimulus as movement of said first movable element; and

said third sensor comprises an angular rate sensor having a second movable element, said angular rate sensor being adapted to sense an angular rate stimulus as movement of said second movable element.

13. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:

forming a first structure having a substrate layer, a first sensor, and a second sensor, said first and second sensors being positioned on a first side of said substrate layer, and said second sensor being laterally spaced apart from said first sensor;

forming a conductive via extending through a second structure from a third side to a fourth side of said second structure;

coupling said fourth side of said second structure with said first structure such that said first and second sensors are interposed between said substrate layer and said second structure;

forming a first port and a second port in a second side of said substrate layer, said first port extending through said substrate layer to expose a sense element of said first sensor to an external environment, and said second port extending through said substrate layer to temporarily expose said second sensor to said external environment; and

attaching a third structure to said second side of said substrate layer such that said second port is hermetically sealed by said third structure and an external port of said third structure is aligned with said first port, said attaching operation being performed following said coupling operation.

14. A method as claimed in claim 13 further comprising forming a conductive interconnect on said third side of said second structure, said conductive interconnect being in electrical communication with said conductive via.

15. A method as claimed in claim 13 wherein said coupling operation produces a first cavity and a second cavity, said second cavity being physically isolated from said first cavity, and wherein said first sensor is located in said first cavity and said second sensor is located in said second cavity.

16. A method as claimed in claim 15 further comprising producing said first cavity to have a first cavity pressure that is different from a second cavity pressure of said second cavity.

17. A method as claimed in claim 13 wherein said first structure further includes a third sensor positioned on said first side of said substrate layer and laterally spaced apart from said first and second sensors.

18. A microelectromechanical systems (MEMS) sensor device comprising:

a first structure having a substrate layer, a first sensor, and a second sensor, said first and second sensors being positioned on a first side of said substrate layer, said second sensor being laterally spaced apart from said first sensor, and said first structure further having a first port and a second port formed in a second side of said substrate layer, said first port extending through said substrate layer to expose a sense element of said first sensor to an external environment, and said second port extending through said substrate layer to said second sensor;

a second structure coupled with said first structure to produce at least one hermetically sealed cavity between said substrate layer and said second structure in which said first and second sensors are located; and

a third structure having an external port extending through said third structure, said third structure being attached to said second side of said substrate layer such that said second port is hermetically sealed by said third structure and said external port is aligned with said first port.

19. A MEMS sensor device as claimed in claim 18 wherein said second structure comprises:

a third side, a fourth side, and a conductive via extending through said second structure from said third side to said fourth side; and

a conductive interconnect formed on said third side of said second structure, said conductive interconnect being in electrical communication with said conductive via.

20. A MEMS sensor device as claimed in claim 18 wherein:

said at least one cavity includes a first cavity and a second cavity physically isolated from said first cavity, said first cavity having a cavity pressure that is less than a second cavity pressure of said second cavity;

said first sensor comprises a pressure sensor located in said first cavity, said sense element is a diaphragm interposed between said first cavity and said first port, said diaphragm is exposed to said external environment via said first port and said external port, said diaphragm being movable in response to a pressure stimulus from said external environment; and

said second sensor comprises an inertial sensor located in said second cavity, said inertial sensor having a movable element, said second sensor being adapted to sense a motion stimulus as movement of said movable element.