NON-CONDUCTIVE FILM AND NON-CONDUCTIVE PASTE INCLUDING ZINC PARTICLES, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
First Claim
1. A non-conductive material layer selected from a non-conductive film (NCF) and a non-conductive polymer paste (NCP) comprising a dispersion of zinc (Zn) particles having an average particle diameter of about 1 nm to about 200 nm in a non-conductive polymer base material of a film type.
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Accused Products
Abstract
A non-conductive material layer, selected from a non-conductive film and a non-conductive polymer paste, and containing a dispersion of zinc (Zn) particles is disclosed, together with semiconductor packages including the non-conductive material layer. The non-conductive material layer contains zinc (Zn) particles having an average particle diameter of about 1 nm to about 200 nm in a non-conductive polymer base material of a film type, and a semiconductor package includes the non-conductive film. By using the non-conductive film and/or the non-conductive paste containing the zinc dispersion, e a semiconductor package having excellent electric connection properties and high reliability may be manufactured through simple processes at low manufacturing costs.
28 Citations
20 Claims
- 1. A non-conductive material layer selected from a non-conductive film (NCF) and a non-conductive polymer paste (NCP) comprising a dispersion of zinc (Zn) particles having an average particle diameter of about 1 nm to about 200 nm in a non-conductive polymer base material of a film type.
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6. A semiconductor package comprising:
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a first substrate including first electrode terminals; a second substrate including second electrode terminals facing the first electrode terminals; and a non-conductive material layer containing a dispersion of zinc (Zn) particles having an average particle diameter of about 1 nm to about 200 nm, where the non-conductive material layer is disposed between the first substrate and the second substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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- 16. A semiconductor package comprising at least first and second semiconductor devices disposed on a substrate, where the first and second semiconductor devices are separated from each other and have corresponding facing electrical connection pads connected by first device-to-second device tin-based solder bumps, the improvement comprising a non-conductive material layer between the first and second semiconductor devices that surrounds and contacts the first device-to-second device solder bumps, said non-conductive material layer comprising a non-conductive polymer based material containing a dispersion of zinc particles.
Specification