CHIP HEAT DISSIPATION STRUCTURE AND LIQUID CRYSTAL DISPLAY HAVING THEREOF

• US 20150103303A1
• Filed: 07/04/2012
• Published: 04/16/2015
• Est. Priority Date: 06/28/2012
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Zhang, Yanxue, Hsiao, Yu-Chun
• Granted Patent: US 9,075,261 B2
• Time in Patent Office: Days
• US Class Current: 349/161
• CPC Class Codes: G02F 1/133382 Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20963 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20972 takes precedence

Abstract

A chip heat dissipation structure and a liquid crystal display having thereof are provided. The chip heat dissipation structure includes a metal heat dissipation member contacted with a chip. The metal heat dissipation member is connected to a metal protection cover of a printed circuit board. The metal heat dissipation member is perpendicular to the metal protection cover. The present invention also relates to a liquid crystal display. The chip heat dissipation structure and a liquid crystal display having thereof of the present invention have a good heat dissipation effect.

Claims

1. A chip heat dissipation structure, which is disposed in a liquid crystal display, wherein the chip heat dissipation structure comprising:

a metal heat dissipation member, being closely adjacent to a chip in the liquid crystal display and contacting with the chip, the metal heat dissipation member being connected to a metal protection cover of a printed circuit board in the liquid crystal display, and the metal heat dissipation member being perpendicular to the metal protection cover;

the metal heat dissipation member being formed by bending the metal protection cover of the printed circuit board;

the metal heat dissipation member including at least one protrusion, the protrusion protruding toward the chip, and the protrusion forming a face contact with the chip.

2. The chip heat dissipation structure as claimed in claim 1, wherein the chip heat dissipation structure further comprises a heat dissipation adhesive film disposed on an inner surface of the metal heat dissipation member facing the chip, and the heat dissipation adhesive film forms a face contact with the chip.

3. The chip heat dissipation structure as claimed in claim 1, wherein a connecting location of the metal heat dissipation member and the metal protection cover disposes at least one strengthening structure thereon.

4. A chip heat dissipation structure, which is disposed in a liquid crystal display, wherein the chip heat dissipation structure comprising:

a metal heat dissipation member, being closely adjacent to a chip in the liquid crystal display and contacting with the chip, the metal heat dissipation member being connected to a metal protection cover of a printed circuit board in the liquid crystal display, and the metal heat dissipation member being perpendicular to the metal protection cover.

5. The chip heat dissipation structure as claimed in claim 4, wherein the metal heat dissipation member is formed by bending the metal protection cover of the printed circuit board.

6. The chip heat dissipation structure as claimed in claim 4, wherein the metal heat dissipation member includes at least one protrusion, the protrusion protrudes toward the chip, and the protrusion forms a face contact with the chip.

7. The chip heat dissipation structure as claimed in claim 4, wherein the chip heat dissipation structure further comprises a heat dissipation adhesive film disposed on an inner surface of the metal heat dissipation member facing the chip, and the heat dissipation adhesive film forms a face contact with the chip.

8. The chip heat dissipation structure as claimed in claim 6, wherein the chip heat dissipation structure further comprises a heat dissipation adhesive film disposed on an inner surface of the metal heat dissipation member facing the chip, and the heat dissipation adhesive film forms a face contact with the chip.

9. The chip heat dissipation structure as claimed in claim 4, wherein a connecting location of the metal heat dissipation member and the metal protection cover disposes at least one strengthening structure thereon.

10. A liquid crystal display, comprising:

a liquid crystal panel;

a chip, being used to drive the liquid crystal panel for displaying an image;

a printed circuit board, being used to arrange a driving circuit of the liquid crystal panel, and disposing a metal protection cover thereon to protect the printed circuit board; and

a metal heat dissipation member, being closely adjacent to the chip and contacting with the chip;

the metal heat dissipation member being connected to the metal protection cover, and the metal heat dissipation member being perpendicular to the metal protection cover.

11. The liquid crystal display as claimed in claim 10, wherein the liquid crystal display further comprises a plastic front frame around a peripheral surface thereof

12. The liquid crystal display as claimed in claim 10, wherein the metal heat dissipation member is formed by bending the metal protection cover of the printed circuit board.

13. The liquid crystal display as claimed in claim 10, wherein the metal heat dissipation member includes at least one protrusion, the protrusion protrudes toward the chip, and the protrusion forms a face contact with the chip.

14. The liquid crystal display as claimed in claim 10, wherein the chip heat dissipation structure further comprises a heat dissipation adhesive film disposed on an inner surface of the metal heat dissipation member facing the chip, and the heat dissipation adhesive film fours a face contact with the chip.

15. The liquid crystal display as claimed in claim 13, wherein the chip heat dissipation structure further comprises a heat dissipation adhesive film disposed on an inner surface of the metal heat dissipation member facing the chip, and the heat dissipation adhesive film forms a face contact with the chip.

16. The liquid crystal display as claimed in claim 10, wherein a connecting location of the metal heat dissipation member and the metal protection cover disposes at least one strengthening structure thereon.