SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
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Abstract
An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
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Citations
22 Claims
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1. (canceled)
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2. A semiconductor device comprising:
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a substrate; a gate electrode over the substrate; a first insulating film over the gate electrode, the first insulating film comprising silicon and nitrogen; a second insulating film over the first insulating film, the second insulating film comprising silicon and oxygen; an oxide semiconductor film over the second insulating film, the oxide semiconductor film comprising indium and oxygen; a source electrode over the oxide semiconductor film; a drain electrode over the oxide semiconductor film; a third insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, the third insulating film comprising silicon and oxygen; a fourth insulating film made of a silicon nitride film over the third insulating film; and a pixel electrode over the fourth insulating film, the pixel electrode being electrically connected to one of the source electrode and the drain electrode, wherein the third insulating film is in contact with a top surface of the oxide semiconductor film and is thicker than the fourth insulating film. - View Dependent Claims (7, 11, 15, 19)
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3. A semiconductor device comprising:
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a substrate; a gate electrode over the substrate; a first insulating film over the gate electrode, the first insulating film comprising silicon and nitrogen; a second insulating film over the first insulating film, the second insulating film comprising silicon, oxygen, and nitrogen; an oxide semiconductor film over the second insulating film, the oxide semiconductor film comprising indium and oxygen; a source electrode over the oxide semiconductor film; a drain electrode over the oxide semiconductor film; a third insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, the third insulating film comprising silicon, oxygen, and nitrogen; a fourth insulating film made of a silicon nitride film over the third insulating film; and a pixel electrode over the fourth insulating film, the pixel electrode being electrically connected to one of the source electrode and the drain electrode, wherein the third insulating film is in contact with a top surface of the oxide semiconductor film and is thicker than the fourth insulating film. - View Dependent Claims (8, 12, 16, 20)
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4. A semiconductor device comprising:
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a substrate; a gate electrode over the substrate; a first insulating film over the gate electrode, the first insulating film comprising silicon and nitrogen; a second insulating film over the first insulating film, the second insulating film comprising silicon and oxygen; an oxide semiconductor film over the second insulating film, the oxide semiconductor film comprising indium and oxygen; a source electrode over the oxide semiconductor film; a drain electrode over the oxide semiconductor film; a third insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, the third insulating film comprising silicon and oxygen; a fourth insulating film made of a silicon nitride film over the third insulating film; a pixel electrode over the fourth insulating film, the pixel electrode being electrically connected to one of the source electrode and the drain electrode; and a fifth insulating film between the oxide semiconductor film and each of the source electrode, the drain electrode, and the third insulating film, the fifth insulating film comprising silicon and oxygen, wherein the fifth insulating film is sandwiched by and in contact with each of the oxide semiconductor film and the third insulating film, wherein the fourth insulating film is in contact with the third insulating film, and wherein a layer comprising the third insulating film and the fifth insulating film is thicker than the fourth insulating film. - View Dependent Claims (9, 13, 17, 21)
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5. A semiconductor device comprising:
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a substrate; a gate electrode over the substrate; a first insulating film over the gate electrode, the first insulating film comprising silicon and nitrogen; a second insulating film over the first insulating film, the second insulating film comprising silicon, oxygen, and nitrogen; an oxide semiconductor film over the second insulating film, the oxide semiconductor film comprising indium and oxygen; a source electrode over the oxide semiconductor film; a drain electrode over the oxide semiconductor film; a third insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, the third insulating film comprising silicon, oxygen, and nitrogen; a fourth insulating film made of a silicon nitride film over the third insulating film; a pixel electrode over the fourth insulating film, the pixel electrode being electrically connected to one of the source electrode and the drain electrode; and a fifth insulating film between the oxide semiconductor film and each of the source electrode, the drain electrode, and the third insulating film, the fifth insulating film comprising silicon and oxygen, wherein the fifth insulating film is sandwiched by and in contact with each of the oxide semiconductor film and the third insulating film, wherein the fourth insulating film is in contact with the third insulating film, and wherein a layer comprising the third insulating film and the fifth insulating film is thicker than the fourth insulating film. - View Dependent Claims (6, 10, 14, 18, 22)
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Specification