SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A semiconductor structure, comprising:
- a substrate and a circuitry on the substrate;
a metal structure electrically coupled with the circuitry through a conductive plug;
a semiconductor die bonded with the substrate through a bump via a conductive pad on an active surface of the semiconductor die, and a passive surface of the semiconductor die contacting a dummy portion of the metal structure, wherein the passive surface is opposite to the active surface; and
a molding compound between the substrate and the active surface of the semiconductor die and surrounding the conductive plug.
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Accused Products
Abstract
A semiconductor structure includes a three dimensional stack including a first semiconductor die and a second semiconductor die. The second semiconductor die is connected with the first semiconductor die with a bump between the first semiconductor die and the second semiconductor die. The semiconductor structure includes a molding compound between the first semiconductor die and the second semiconductor die. A first portion of a metal structure over a surface of the three dimensional stack and contacting a backside of the second semiconductor die and a second portion of the metal structure over the surface of the three dimensional stack and configured for electrically connecting the three dimensional stack with an external electronic device.
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Citations
27 Claims
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1. A semiconductor structure, comprising:
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a substrate and a circuitry on the substrate; a metal structure electrically coupled with the circuitry through a conductive plug; a semiconductor die bonded with the substrate through a bump via a conductive pad on an active surface of the semiconductor die, and a passive surface of the semiconductor die contacting a dummy portion of the metal structure, wherein the passive surface is opposite to the active surface; and a molding compound between the substrate and the active surface of the semiconductor die and surrounding the conductive plug. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 21, 22, 23, 24)
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10. A semiconductor structure, comprising:
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a three dimensional stack comprising; a first semiconductor die; and a second semiconductor die connected with the first semiconductor die with a bump between the first semiconductor die and the second semiconductor die; and a molding compound between the first semiconductor die and the second semiconductor die; a first portion of a metal structure over a surface of the three dimensional stack and contacting a backside of the second semiconductor die; and a second portion of the metal structure over the surface of the three dimensional stack and configured for electrically connecting the three dimensional stack with an external electronic device. - View Dependent Claims (11, 12, 14, 25, 26, 27)
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13. (canceled)
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15-20. -20. (canceled)
Specification