SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS
First Claim
Patent Images
1. A sensor device comprising:
- a first structure having a sensing arrangement thereon;
a second structure having circuitry thereon; and
a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure.
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Abstract
Sensor device packages and related fabrication methods are provided. An exemplary sensor device package includes a first structure having a sensing arrangement thereon, a second structure having circuitry thereon, and a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure. Thus, circuitry on the second structure may be electrically connected to an interface of the sensor device package through the first structure.
25 Citations
20 Claims
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1. A sensor device comprising:
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a first structure having a sensing arrangement thereon; a second structure having circuitry thereon; and a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A sensor device package comprising:
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a package interface; a first sensor die overlying the package interface, the first sensor die having a first sensing arrangement thereon; a first conductive structure within the first sensor die, the first conductive structure extending through the first sensor die and being coupled to the package interface to provide an electrical connection through the first sensor die to the package interface; and a second die overlying the first sensor die, the second die having circuitry thereon, the circuitry being coupled to the first sensing arrangement to determine a metric indicative of a sensed characteristic based on one or more signals from the first sensing arrangement, wherein the circuitry is coupled to the first conductive structure to provide one or more output signals indicative of the metric to the package interface via the electrical connection. - View Dependent Claims (16, 17)
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18. A method of fabricating a sensor device, the method comprising:
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forming a conductive structure within a first semiconductor substrate and extending through the first semiconductor substrate, the first semiconductor substrate having a first sensing arrangement fabricated thereon; providing a first electrical connection between the conductive structure and an interface of the sensor device; and providing a second electrical connection between the conductive structure and circuitry fabricated on a second semiconductor substrate, resulting in an electrical connection between the circuitry and the interface through the first semiconductor substrate. - View Dependent Claims (19, 20)
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Specification