×

SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS

  • US 20150108653A1
  • Filed: 10/18/2013
  • Published: 04/23/2015
  • Est. Priority Date: 10/18/2013
  • Status: Active Grant
First Claim
Patent Images

1. A sensor device comprising:

  • a first structure having a sensing arrangement thereon;

    a second structure having circuitry thereon; and

    a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure.

View all claims
  • 22 Assignments
Timeline View
Assignment View
    ×
    ×