HEAT DISSIPATING HIGH POWER SYSTEMS

• US 20150109750A1
• Filed: 01/05/2015
• Published: 04/23/2015
• Est. Priority Date: 03/11/2011
• Status: Active Grant

• Current Assignee: Marvell Israel Limited (Marvell Technology Group Limited)
• Original Assignee: Marvell Israel Limited (Marvell Technology Group Limited)
• Inventors: ELKASLASSY, Daniel, KALMANOVIZ, Daniel
• Granted Patent: US 9,408,308 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/306 Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.

Claims

1. A printed circuit board (PCB) comprising:

first electronic components are mounted on a first side of the PCB, the first electronic components have a power consumption that is greater than a power consumption threshold for the first electronic components and greater than power consumptions of second electronic components mounted on a second side of the PCB and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB; and

the second electronic components are mounted on the second side of the PCB, and at least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components.

2. The PCB of claim 1, wherein the first electronic components are active components.

3. The PCB of claim 2, wherein the active components include at least an integrated circuit (IC) chip.

4. The PCB of claim 3, wherein the IC chip is one of a switch chip, a controller chip, a transceiver chip, and a memory chip.

5. The PCB of claim 1, wherein the first electronic components are surface-mount components.

6. The PCB of claim 1, wherein the second electronic components are passive non-integrated circuit (IC) components.

7. The PCB of claim 6, wherein the passive non-IC components include at least one of an inductor, a capacitor, and a connector.

8. The PCB of claim 7, wherein the connector is one of an Ethernet connector, a small form factor pluggable (SFP) cage connector, and a board connector.

9. The PCB of claim 1, wherein the second electronic components are through-hole mount components.

10. The PCB of claim 9, wherein the through-hole mount components are hand assembled on the second side at a PCB assembly line.

11. A method for assembling a printed circuit board (PCB), the method comprising:

mounting first electronic components on a first side of the PCB, the first electronic components having a power consumption that is greater than a power consumption threshold for the first electronic components and greater than power consumptions of second electronic components, the first electronic components additionally having a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB; and

mounting the second electronic components on a second side of the PCB, at least one of the second electronic components having a height over the second side of the PCB that is higher than the height of the first electronic components.

12. The method of claim 11, wherein mounting the first electronic components comprises:

mounting electronic components that are active components.

13. The method of claim 12, wherein mounting the electronic components comprises:

mounting at least an integrated circuit (IC) chip.

14. The method of claim 13, wherein mounting the at least an IC chip comprises:

mounting one of a switch chip, a controller chip, a transceiver chip, and a memory chip.

15. The method of claim 11, wherein mounting the first electronic components comprises:

mounting electronic components that are surface-mount components.

16. The method of claim 11, wherein mounting the second electronic components comprises:

mounting electronic components that are passive non-integrated circuit (IC) components.

17. The method of claim 16, wherein mounting the electronic components comprises:

mounting at least one of an inductor, a capacitor, and a connector.

18. The method of claim 17, wherein mounting the connector comprises:

mounting one of an Ethernet connector, a small form factor pluggable (SFP) cage connector, and a board connector.

19. The method of claim 11, wherein mounting the second electronic components comprises:

mounting electronic components that are through-hole mount components.

20. The method of claim 19, wherein mounting the electronic components comprises:

hand assembling components on the second side at a PCB assembly line.