METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS AND COMPONENTS

• US 20150112646A1
• Filed: 12/18/2013
• Published: 04/23/2015
• Est. Priority Date: 10/23/2013
• Status: Abandoned Application

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Kamal, Pratyush, Du, Yang, Samadi, Kambiz
• Application Number:
  US14/132,377
• Publication Number:
  US 20150112646A1
• Time in Patent Office: Days
• US Class Current: 703/1
• CPC Class Codes: G06F 2111/04 Constraint-based CAD
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347

Abstract

Methods of designing three dimensional integrated circuits (3DIC) and related systems and components are disclosed. An exemplary embodiment provides an improved cell library for use with existing place and route software in such a manner that the modified software allows building 3DICs. The improved cell library includes 3D cells that have the footprint of the cell projected onto a two dimensional (2D) image. The projected view may then be discounted to the portion of the cell that is within an upper tier so that the cell appears to the place and route software to be a 2D cell. The discounted 2D image is then used by the place and route software. Such cells allow a circuit designer to leverage the existing 2D place and route tools as well as static timing analysis tools.

Claims

1. A non-transitory computer readable medium comprising software with instructions to:

store a library of cells that model elements within an integrated circuit (IC), the library of cells containing cells that;

model at least one two dimensional (2D) cell for placement in an upper tier of a three dimensional (3D) IC (3DIC);

model at least one 2D cell for placement in a lower tier of the 3DIC; and

model at least one 3D cell for placement in a plurality of tiers of the 3DIC;

allow a user to select cells from the library for placement in the 3DIC such that the upper and lower tiers have identical x-y dimensions;

constrain placement of cells based on potential overlap of bottom tier elements within one or more cells; and

automatically provide a layout of conductive interconnections between placed cells.

2. The non-transitory computer readable medium of claim 1, wherein the software with instructions has further instructions to automatically place one or more cells selected by the user.

3. The non-transitory computer readable medium of claim 1, wherein the software further exports computer aided manufacturing instructions for manufacturing of a 3DIC modeled by the software.

4. The non-transitory computer readable medium of claim 1, wherein the software further has instructions to provide a completed 3DIC model on a display to the user.

5. The non-transitory computer readable medium of claim 1, wherein the instructions to allow the user to select cells from the library for placement in the 3DIC comprise instructions that interoperate with input elements selected from the group consisting of:

a mouse, a stylus, a display, a keyboard, a trackball, and a touch screen.

6. The non-transitory computer readable medium of claim 1, wherein the instructions to store a library of cells that model the at least one 3D cell for placement in the plurality of tiers of the 3DIC comprise a model of a 3D cell having active elements on the upper tier and additional active elements on the lower tier.

7. The non-transitory computer readable medium of claim 1, wherein the x-y dimensions define a horizontal plane.

8. A computing device, comprising:

a user interface having hardware elements with which a user may physically interact;

memory elements;

a control system operatively coupled to the memory elements and the user interface, the control system configured to;

store in the memory elements a library of cells that model elements within an integrated circuit (IC), the library of cells containing cells that;

model at least one two dimensional (2D) cell for placement in an upper tier of a three dimensional (3D) IC (3DIC);

model at least one 2D cell for placement in a lower tier of the 3DIC; and

model at least one 3D cell for placement in a plurality of tiers of the 3DIC;

allow a user to select cells from the library for placement in the 3DIC such that the upper and lower tiers have identical x-y dimensions;

constrain placement of cells based on potential overlap of bottom tier elements within one or more cells; and

automatically provide a layout of conductive interconnections between placed cells.

9. The computing device of claim 8, wherein the user interface comprises at least one of a mouse, a display, a stylus, keyboard, a touch screen, and a trackball.

10. The computing device of claim 8, wherein the control system is further configured to automatically place one or more cells selected by the user.

11. The computing device of claim 8, wherein the control system is further configured to export computer aided manufacturing instructions for manufacturing of a 3DIC modeled by the control system.

12. The computing device of claim 8, wherein the x-y dimensions define a horizontal plane.

13. The computing device of claim 8, wherein the control system is further configured to provide a completed 3DIC model on a display within the user interface.

14. A method of using a computing device loaded with place and route software to design a three dimensional (3D) integrated circuit (IC) (3DIC), comprising:

storing a library of cells that model elements within an IC in non-transitory memory elements of the computing device, wherein cells are selected from a group of cells that;

model at least one two dimensional (2D) cell for placement in an upper tier of the 3DIC;

model at least one 2D cell for placement in a lower tier of the 3DIC;

model at least one 3D cell for placement in a plurality of tiers of the 3DIC;

allowing a user to select cells from the library for placement in the 3DIC;

constraining dimensions of tiers within the 3DIC such that x-y dimensions of each tier are identical;

constraining placement of cells based on potential overlap of bottom tier elements within one or more cells;

automatically providing a layout of conductive interconnections between placed cells.

15. The method of claim 14, further comprising automatically placing one or more cells selected by the user.

16. The method of claim 14, further comprising exporting computer aided manufacturing instructions for manufacturing of a 3DIC modeled by the place and route software.

17. The method of claim 14, further comprising allowing input from the user through one of a mouse, a stylus, a keyboard, a trackball, and a touch screen.

18. The method of claim 14, further comprising allowing users to define new cells for the library.

19. The method of claim 14, wherein the x-y dimensions define a horizontal plane.

20. The method of claim 14, further comprising presenting on a display a completed 3DIC model.

21. The method of claim 14, further comprising creating a placement constraint on the cell that models at least one 2D cell for placement in the lower tier of the 3DIC.

22. The method of claim 14, further comprising routing between cells using metal layers associated with the upper tier.