High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application
First Claim
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1. An apparatus for a multilayer printed circuit board (PCB) coil, comprising:
- a first coil layer of a PCB;
a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and
a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer,wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
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Abstract
An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
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Citations
25 Claims
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1. An apparatus for a multilayer printed circuit board (PCB) coil, comprising:
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a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil. - View Dependent Claims (2, 3, 4, 5)
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6. An apparatus for power transfer, comprising:
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a multilayer printed circuit board (PCB) coil comprising; a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the first coil layer, the vias, and the second coil layer are integrated within the PCB, wherein the multilayer PCB coil is configured to transfer energy with an electric coil using resonant inductive coupling when the multilayer PCB coil is coupled to the electric coil, and wherein resonant inductive coupling is implemented by tuning the multilayer PCB coil and the electric coil to substantially a same frequency. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for wireless power transfer, comprising:
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resonating a multilayer printed circuit board (PCB) coil at a first frequency; and receiving a power transfer at the multilayer PCB coil via resonant inductive coupling from a transmitting coil that resonates at a second frequency, wherein the first frequency and second frequency are substantially the same, wherein the PCB coil comprises; a first coil layer of a PCB formed using a PCB winding trace; a plurality of vias coupled to and distributed along the PCB winding trace; and a second coil layer of the PCB formed using a second PCB winding trace, wherein the first coil layer, the vias, and the second coil layer are integrated within the PCB, and wherein the first coil layer and the second coil layer are joined together using the vias. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification