ELECTRONIC PACKAGE STRUCTURE

• US 20150116960A1
• Filed: 01/10/2015
• Published: 04/30/2015
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: CHEN, DA-JUNG, Liu, Chun-Tiao, LU, BAU-RU
• Granted Patent: US 9,538,660 B2
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 27/40 Structural association with built-in electric component, e.g. fuse
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/10537 : Attached components
• CPC Class Codes: H05K 2201/10924 : Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Claims

1. An electronic package structure, comprising:

at least one first conductive element;

a body encapsulating the at least one first conductive element, the body comprising a first protrusion and a second protrusion on a top surface of the body to form a cavity thereon; and

at least one second conductive element, disposed in the cavity and electrically coupled to the at least one first conductive element.

2. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element is disposed on a lead frame, wherein the lead frame is disposed in the cavity and electrically connected to the at least one first conductive element.

3. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element is disposed on a circuit substrate, wherein the circuit substrate is disposed on the first protrusion and the second protrusion and electrically connected to the at least one first conductive element.

4. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element is disposed on a circuit substrate, wherein the circuit substrate is disposed in the cavity and electrically connected to the at least one first conductive element.

5. The electronic package structure as claimed in claim 1, wherein the at least one first conductive element is electrically connected to a first electrode disposed on the top surface of the first protrusion via a first electrical path disposed inside the body.

6. The electronic package structure as claimed in claim 2, wherein the at least one first conductive element is electrically connected to a second electrode disposed on the top surface of the second protrusion via a second electrical path disposed inside the magnetic body.

7. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element comprises an IC.

8. The electronic package structure as claimed in claim 1, wherein the at least one first conductive element is electrically connected to a first electrode disposed on the top surface of the first protrusion via a first electrical path disposed inside the body and a second electrode disposed on the top surface of the second protrusion via a second electrical path disposed inside the body.

9. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element comprises a MOSFET.

10. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element comprises an IGBT.

11. The electronic package structure as claimed in claim 1, wherein the at least one first conductive element is electrically connected to a first electrode disposed on a first side surface of the body and a second electrode disposed on a second side surface of the body opposite to the first side surface.

12. The electronic package structure as claimed in claim 1, wherein the electronic package structure is a DC/DC converter or a point-of-load (POL) converter.

13. The electronic package structure as claimed in claim 1, wherein the at least one first conductive element is electrically connected to a first electrode disposed on a first side surface of the first protrusion via a first electrical path disposed inside the body and a second electrode disposed on a second side surface of the second protrusion via a second electrical path disposed inside the body.

14. The electronic package structure as claimed in claim 1, wherein the at least one second conductive element comprises an EMI-shielding element to cover other conductive elements disposed in the conductive module.

15. The electronic package structure as claimed in claim 1, wherein an EMI-shielding element is disposed on the body to cover the at least one second conductive disposed in the cavity.

16. The electronic package structure as claimed in claim 1, wherein the first conductive element is a coil.

17. The electronic package structure as claimed in claim 1, wherein the body is a magnetic body.