ELECTRONIC PACKAGE STRUCTURE
First Claim
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1. A choke, comprising:
- a conductor wire;
a magnetic body encapsulating the conductor wire, the magnetic body comprising a first protrusion and a second protrusion on a top surface of the magnetic body to form a cavity thereon, wherein at least one conductive element is disposed in the cavity and electrically coupled to the conductor wire.
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Abstract
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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Citations
20 Claims
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1. A choke, comprising:
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a conductor wire; a magnetic body encapsulating the conductor wire, the magnetic body comprising a first protrusion and a second protrusion on a top surface of the magnetic body to form a cavity thereon, wherein at least one conductive element is disposed in the cavity and electrically coupled to the conductor wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification