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SUBSTRATE TREATING APPARATUS AND METHOD

  • US 20150118416A1
  • Filed: 10/30/2014
  • Published: 04/30/2015
  • Est. Priority Date: 10/31/2013
  • Status: Abandoned Application
First Claim
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1. A substrate treating apparatus, comprising:

  • a processing chamber having an inner space;

    a substrate supporting unit disposed in the processing chamber and supporting a substrate;

    an antenna plate disposed above the substrate supporting unit and having a plurality of slots therein;

    a dielectric plate provided under the antenna plate, and allowing microwave to be propagated into and pass through the inner space of the processing chamber; and

    a gas supplying unit provided at a height between the dielectric plate and the substrate supporting unit, and supplying a gas into the processing chamber,wherein the gas supplying unit comprisesa first injection unit disposed at a first height and supplying a first gas anda second injection unit positioned at a second height which is lower than the first height, and supplying a second gas which differs in type from the first gas.

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