PRESSURE SENSOR

• US 20150122042A1
• Filed: 10/23/2014
• Published: 05/07/2015
• Est. Priority Date: 11/06/2013
• Status: Active Grant

• Current Assignee: InvenSense International, LLC (TDK Corporation)
• Original Assignee: Sensirion AG (Sensirion Holding AG)
• Inventors: LIN, Chung-Hsien, Hummel, Rene, Bartsch, Ulrich, Hermersdorf, Marion, Tang, Tsung Lin, Su, Wang Shen, Lin, Chia Min
• Granted Patent: US 9,581,512 B2
• Time in Patent Office: Days
• US Class Current: 73/754
• CPC Class Codes: B23P 19/04 for assembling or disassembling parts
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 7/0051 between the package lid and the substrate
• CPC Class Codes: B81B 7/0054 between other parts not provided for in B81B7/0048 - B81B7/0051
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/145 with stress relieving means
• CPC Class Codes: G01L 19/146 using flexible element between the transducer and the support
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01L 9/12 by making use of variations in capacitance , i.e. electric circuits therefor
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49904 Assembling a subassembly, then assembling with a second subassembly

Abstract

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

Claims

1. A pressure sensor, comprising

a first substrate,

a cap attached to the first substrate wherein the cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor, and

sensing means for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit,

wherein the cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port,

wherein the first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

2. The sensor of claim 1,

wherein the first substrate has a plane extension and wherein the support portion encircles the contact portion in the plane of the first substrate,

wherein the support portion is separated from the contact portion except for the one or more suspension elements by one or more grooves in the first substrate.

3. The sensor of claim 1,

wherein each suspension element contains a ridge between the support portion and the contact portion, and

wherein one or more of the suspension elements includes at least one electrically conducting path for electrically connecting the support portion to the contact portion.

4. The sensor of claim 1,

wherein the first substrate has a front side facing the deformable membrane, a backside containing electrical contacts for electrically connecting the pressure sensor to the external device, and vias for electrically connecting the front side of the first substrate to its backside.

5. The sensor of claim 4,

wherein the electrical contacts are arranged in the contact portion,

wherein the vias are arranged in the support portion, and

wherein the vias are electrically connected to the contact portion through one or more of the suspension elements.

6. The sensor of claim 1,

wherein the cap contains a second substrate containing a bulk material and layers stacked on the bulk material,

wherein the cavity is a recess exclusively arranged in one or more of the layers of the second substrate,

wherein the processing circuit is integrated in the second substrate, and

wherein the deformable membrane is made from a third substrate attached to the layers of the second substrate.

7. The sensor of claim 6,

wherein the sensing means contains a first electrode formed by the deformable membrane and a second electrode formed by one of the layers of the second substrate,

wherein the first electrode and the second electrode are connected to the processing circuit.

8. The sensor of claim 7,

comprising spacer elements between the first substrate and the third or the second substrate for building the gap, and

wherein at least some of the spacer elements are used as electrical connections between the cap and the first substrate.

9. A method for manufacturing a pressure sensor, comprising the steps of

providing a first substrate,

providing a second substrate,

providing a third substrate,

manufacturing a cavity in the second substrate,

mounting the third substrate to the second substrate thereby covering the cavity in the second substrate to form a deformable membrane for sensing a pressure applied to the deformable membrane,

mounting the assembly of the second substrate and the third substrate to a support portion of the first substrate with the deformable membrane facing the first substrate and providing a gap between the deformable membrane and the first substrate, and

manufacturing grooves into the first substrate around a contact portion for electrically connecting the pressure sensor to an external device, thereby making the support portion suspend from the contact portion by means of suspension elements.

10. The method of claim 9,

wherein manufacturing the cavity in the second substrate includes manufacturing the cavity in one or more layers stacked on a bulk material of the second substrate, and

wherein mounting the third substrate to the second substrate to form the deformable membrane includes attaching a silicon-on-insulator substrate to a top layer of the second substrate, removing a bulk material and an insulating layer of the silicon-on-insulator substrate thereby leaving a silicon layer as deformable membrane spanning the cavity in the second substrate.

11. The method of claim 9,

wherein manufacturing the grooves into the first substrate includes manufacturing trenches reaching at least partly into the first substrate prior to attaching the assembly to the first substrate.

12. The method of claim 11,

wherein the trenches are manufactured by etching.

13. The method of claim 11,

wherein the trenches that reach partially into the first substrate are manufactured from its front side prior to attaching the assembly to the first substrate, and

wherein the trenches in the first substrate (1) are laid open from its backside after having attached the assembly of the second substrate and the third substrate to the first substrate.

14. The method of claim 9,

wherein electrically conducting vias are built through the first substrate for electrically connecting the processing circuit to electrical contacts arranged on a backside of the first substrate opposite a front side facing the deformable membrane.

15. The method of claim 14,

wherein the vias are built after having mounted the assembly of the second substrate and the third substrate to the first substrate.

16. The method of claim 9,

wherein mounting the third substrate to the second substrate includes in a portion of the third substrate outside the deformable membrane

etching through the third substrate for manufacturing one or more contact windows in the second substrate, and

metalizing the one or more contact windows.

17. The method of claim 9,

wherein the gap between the first substrate and the assembly of the second and third substrate is manufactured by applying spacer elements between the first substrate and the assembly of the second and third substrate.