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SYSTEM AND METHOD FOR FLUX COAT, REFLOW AND CLEAN

  • US 20150122876A1
  • Filed: 11/03/2014
  • Published: 05/07/2015
  • Est. Priority Date: 11/04/2013
  • Status: Active Grant
First Claim
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1. A system for performing a solder reflow process comprising a plurality of stations within one system frame comprising:

  • a first station for coating flux on a substrate;

    a second station for reflowing the flux on the substrate;

    a third station for removing the flux and cleaning the substrate; and

    an automated transfer device for transferring the substrate from one station to another station.

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