SYSTEM AND METHOD FOR FLUX COAT, REFLOW AND CLEAN
First Claim
1. A system for performing a solder reflow process comprising a plurality of stations within one system frame comprising:
- a first station for coating flux on a substrate;
a second station for reflowing the flux on the substrate;
a third station for removing the flux and cleaning the substrate; and
an automated transfer device for transferring the substrate from one station to another station.
3 Assignments
0 Petitions
Accused Products
Abstract
The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.
32 Citations
22 Claims
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1. A system for performing a solder reflow process comprising a plurality of stations within one system frame comprising:
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a first station for coating flux on a substrate; a second station for reflowing the flux on the substrate; a third station for removing the flux and cleaning the substrate; and an automated transfer device for transferring the substrate from one station to another station. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for performing a solder reflow process in an automated system that includes a plurality of stations comprising:
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coating flux on a substrate at a first station; reflowing the flux on the substrate at a second station; and removing the flux and cleaning the substrate at a third station; wherein the substrate is transferred from one station to another station by an automated transfer device; wherein the step of reflowing the flux on the substrate comprises the steps of; introducing the substrate into a first compartment defined within a reflow device; sealing the first compartment from the rest of an interior of the reflow device and purging the first compartment to create a low oxygen environment; sequentially advancing, in an indexed manner, the substrate to a plurality of zones defined within the interior at which the substrate is subjected to different temperatures to subject the substrate to an optimal temperature profile for reflowing flux in a controlled low oxygen environment, wherein the first compartment comprises a cooling zone in which the substrate is cooled before discharge from the reflow device. - View Dependent Claims (21, 22)
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Specification