COMPOSITE MODULE

• US 20150124409A1
• Filed: 11/14/2014
• Published: 05/07/2015
• Est. Priority Date: 05/22/2012
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kawano, Koji, Enkyo, Naofumi, Kato, Koki
• Granted Patent: US 9,730,363 B2
• Time in Patent Office: Days
• US Class Current: 361/715
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H05K 5/0278 of USB type details relating to connectors H01R27/00
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/20472 Sheet interfaces
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.

Claims

1. A composite module comprising:

a first substrate; and

an external connector mounted on one principal surface of the first substrate,

wherein an electronic component device is disposed in a region of another principal surface of the first substrate opposed to the external connector across the first substrate sandwiched between the stated region and the external connector.

2. The Composite module according to claim 1,

wherein the electronic component device is mounted on the another principal surface of the first substrate.

3. The Composite module according to claim 1, further comprising:

a second substrate disposed as opposed to the another principal surface of the first substrate,

wherein an electronic component device is mounted on one principal surface of the second substrate.

4. The Composite module according to claim 3, further comprising:

a substrate joint connector configured to mechanically connect the first substrate and the second substrate together,

wherein the external connector is mounted on one end side of the first substrate, and

the substrate joint connector is disposed on another end side of the another principal surface of the first substrate.

5. The Composite module according to claim 2,

wherein a heat dissipation member is disposed on a surface of the electronic component device opposite to a mounting-surface of the electronic component device.

6. The Composite module according to claim 3,

wherein a heat dissipation member is so disposed as to make contact with both a surface of the electronic component device opposite to the mounting-surface of the electronic component device and the another principal surface of the first substrate.

7. The Composite module according to claim 1, further comprising an antenna and a housing,

wherein the housing accommodates the composite module and the antenna, and

an inner wall surface of the housing makes contact with the antenna via the composite module.

8. The Composite module according to claim 7,

wherein a cutout configured to prevent at least one of the first substrate and the second substrate from making contact with the inner wall surface of the housing is provided in at least one of the first substrate and the second substrate at a portion in a vicinity of the electronic component device that is disposed in a region opposing the external connector while sandwiching the first substrate between the stated region and the external connector.

9. The Composite module according to claim 3,

wherein a heat dissipation member is disposed on a surface of the electronic component device opposite to a mounting-surface of the electronic component device.

10. The Composite module according to claim 4,

wherein a heat dissipation member is disposed on a surface of the electronic component device opposite to a mounting-surface of the electronic component device.

11. The Composite module according to claim 4,

wherein a heat dissipation member is so disposed as to make contact with both a surface of the electronic component device opposite to the mounting-surface of the electronic component device and the another principal surface of the first substrate.