SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
First Claim
1. A method for manufacturing a semiconductor device comprising:
- laminating an oxide film layer and a first-conductive-type semiconductor layer on a second-conductive-type semiconductor layer in order;
forming an active region in the first-conductive-type semiconductor layer;
forming an insulating film on the first-conductive-type semiconductor layer;
forming a first first-conductive-type region by diffusing, based on the position of the active region, a first-conductive-type impurity within a first region of the second-conductive-type semiconductor layer that includes a lower portion of the active region;
forming a MOS-type transistor in the active region;
removing the oxide film layer from a predetermined region in which a first electrode, a second electrode and a third electrode of the second-conductive-type semiconductor layer are to be formed;
forming, in the first first-conductive-type region, a second first-conductive-type region by diffusing the first-conductive-type impurity within the predetermined region from which the oxide film layer has been removed and on which the first electrode is to be formed and, forming a third first-conductive-type region by diffusing the first-conductive-type impurity within the predetermined region on which the third electrode is to be formed;
forming a second-conductive-type region by diffusing a second-conductive-type impurity within the predetermined region from which the oxide film layer has been removed and in which the second electrode is to be formed; and
forming the first electrode, the second electrode and the third electrode.
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Accused Products
Abstract
There is provided a semiconductor device and a method for manufacturing a semiconductor device. Within the N-type semiconductor layer formed from a high resistance N-type substrate, the P-type well diffusion layer and P-type extraction layer are formed and are fixed to ground potential. Due thereto, a depletion layer spreading on the P-type well diffusion layer side does not reach the interlayer boundary between the P-type well diffusion layer and the buried oxide film. Hence, the potential around the surface of the P-type well diffusion layer is kept at a ground potential. Accordingly, when the voltages are applied to the backside of the N-type semiconductor layer and a cathode electrode, a channel region at the MOS-type semiconductor formed as a P-type semiconductor layer is not activated. Due thereto, leakage current that may occur independently of a control due to the gate electrode of a transistor can be suppressed.
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Citations
2 Claims
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1. A method for manufacturing a semiconductor device comprising:
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laminating an oxide film layer and a first-conductive-type semiconductor layer on a second-conductive-type semiconductor layer in order; forming an active region in the first-conductive-type semiconductor layer; forming an insulating film on the first-conductive-type semiconductor layer; forming a first first-conductive-type region by diffusing, based on the position of the active region, a first-conductive-type impurity within a first region of the second-conductive-type semiconductor layer that includes a lower portion of the active region; forming a MOS-type transistor in the active region; removing the oxide film layer from a predetermined region in which a first electrode, a second electrode and a third electrode of the second-conductive-type semiconductor layer are to be formed; forming, in the first first-conductive-type region, a second first-conductive-type region by diffusing the first-conductive-type impurity within the predetermined region from which the oxide film layer has been removed and on which the first electrode is to be formed and, forming a third first-conductive-type region by diffusing the first-conductive-type impurity within the predetermined region on which the third electrode is to be formed; forming a second-conductive-type region by diffusing a second-conductive-type impurity within the predetermined region from which the oxide film layer has been removed and in which the second electrode is to be formed; and forming the first electrode, the second electrode and the third electrode. - View Dependent Claims (2)
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Specification