STRUCTURAL BOND INSPECTION
First Claim
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1. A method for determining a presence of damage in a structure, comprising:
- applying energy to the structure to induce tension shockwaves in the structure;
detecting sound waves caused by the tension shockwaves using at least one acoustic emission sensor on a surface of the structure; and
determining the presence of damage in the structure due to the applied energy based on detected sound waves.
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Abstract
A method for determining the presence of damage in a structure includes applying energy to the structure to induce tension shockwaves in the structure. The method also includes detecting sound waves caused by the tension shockwaves using at least one acoustic emission sensor on the surface of the structure. Additionally, the method includes determining the presence of damage in the structure due to the applied energy based on detected sound waves.
38 Citations
21 Claims
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1. A method for determining a presence of damage in a structure, comprising:
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applying energy to the structure to induce tension shockwaves in the structure; detecting sound waves caused by the tension shockwaves using at least one acoustic emission sensor on a surface of the structure; and determining the presence of damage in the structure due to the applied energy based on detected sound waves. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A system for concurrently determining strength of a bonded structure and presence of disbonds in the bonded structure, comprising:
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a wave induction tool that induces a shockwave in the bonded structure; a sound wave sensing device that detects a sound wave induced by the shockwave, the sound wave sensing device being in direct contact with a surface of the bonded structure; and a controller that determines the presence of disbonds in the bonded structure based on characteristics of the sound wave detected by the sound wave sensing device, and determining the strength of the bonded structure based on the presence of disbonds in the bonded structure. - View Dependent Claims (16, 17, 18, 19, 21)
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20. An apparatus for concurrently testing strength of a bonded structure and determining a presence of disbonds in the bonded structure, comprising:
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a laser bond inspection module configured to command a transmission of a laser beam onto the bonded structure to induce a shockwave in the bonded structure; at least one acoustic emission sensor in contact with a surface of the bonded structure; and an acoustic emission detection module configured to determine the presence of a disbond in the bonded structure and verify a strength of the bond based on at least one frequency characteristic of a sound wave in the bonded structure induced by the shockwave, the sound wave being detected by the at least one acoustic emission sensor.
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Specification