THERMOSYPHON HEAT SINK

• US 20150129175A1
• Filed: 12/31/2013
• Published: 05/14/2015
• Est. Priority Date: 11/13/2012
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: HUANG, Yu-Hung, TAN, Li-Kuang, WU, Wei-Fang
• Application Number:
  US14/145,223
• Publication Number:
  US 20150129175A1
• Time in Patent Office: Days
• US Class Current: 165/104.21
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.

Claims

1. A heat-dissipating device for contacting with a heating element, comprising:

a condenser comprising a shell having a chamber and a through hole communicating with the chamber, and a main capillary wick disposed in the chamber; and

an evaporator comprising an evaporating section having a gas cavity, a gas conduit communicating with the through hole, and a liquid conduit communicating with the chamber and filling with liquid, wherein the liquid conduit is inserted in the gas conduit and has a hole communicating with the gas cavity, and an outer surface of the evaporating section is contacted with the heating element;

wherein a stepped area is formed at a location where the liquid conduit is assembled with the chamber, the liquid flows in the gas cavity and absorbs the heat generated from the heating element to be transformed into gas and flows in the chamber through the gas conduit, the gas is transformed into the liquid, gathered in the stepped area by cooling of the condenser and flows into the liquid conduit.

2. The heat-dissipating device according to claim 1, wherein the evaporator further comprises an auxiliary evaporating section at a side of the evaporating section away from the condenser, the evaporating section and the auxiliary evaporating section are arranged in a line or disposed in a staggered manner, and the gas conduit and the liquid conduit are extended to the auxiliary evaporating section.

3. The heat-dissipating device according to claim 1, wherein the evaporating section has an opening and a cover corresponding to the opening, the opening is communicated with the gas cavity, the cover has a protrusion at a side away from the opening, and the protrusion is contacted with the heating element.

4. The heat-dissipating device according to claim 3, wherein the auxiliary evaporating section further includes an auxiliary capillary wick, the cover is formed with an embedding slot at a side near the gas cavity, the auxiliary capillary wick comprises a plurality of heat-dissipating fins, a metal net disposed in the embedding slot, a component made of foam, or formed in the embedding slot of the cover by sand blasting.

5. The heat-dissipating device according to claim 1, wherein a protrusion is protruded from a wall of the evaporating section and formed with the evaporating section as a single piece.

6. The heat-dissipating device according to claim 1, wherein a side of the liquid conduit is connected with an inner surface of the gas conduit.

7. The heat-dissipating device according to claim 1, wherein a cross section of the gas conduit is greater than a cross section of the liquid conduit.

8. The heat-dissipating device according to claim 1, wherein the condenser further comprises a lid, an entrance communicating with the chamber and disposed at a side of the shell, and the entrance is sealed by the lid .

9. The heat-dissipating device according to claim 1, wherein a bottom of an inner surface of the chamber is formed with an inclined plane from a side away and tilted from the through hole toward the through hole.

10. The heat-dissipating device according to claim 1, wherein two sides of the bottom of the chamber are formed with an inclined plane from a side away and tilted from the through hole toward the through hole respectively.

11. The heat-dissipating device according to claim 1, wherein a rib is extended between an inner surface of the gas conduit and an outer surface of the liquid conduit.

12. The heat-dissipating device according to claim 1, wherein the condenser further comprises a heat-dissipating body disposed at an upper end or a lower end of the shell.

13. The heat-dissipating device according to claim 12, wherein the heat-dissipating body comprises a plurality of heat-dissipating fins arranged at intervals.

14. The heat-dissipating device according to claim 1, wherein the main capillary wick is a metal net or comprises a plurality of heat-dissipating fins disposed on an inner surface of the chamber.

15. The heat-dissipating device according to claim 1, wherein the main capillary wick is configured in a waved shape.

16. The heat-dissipating device according to claim 1, wherein the stepped area is formed in an inner surface of the chamber and correspondingly located on a bottom of the main capillary wick.

17. The heat-dissipating device according to claim 16, wherein the stepped area is located at the bottom of the center of the chamber and formed as a storage space in the chamber.

18. The heat-dissipating device according to claim 1, wherein an end of the liquid conduit is positioned in the through hole, and the stepped area is formed between an inner surface of the chamber and an inner surface of the liquid conduit.

19. The heat-dissipating device according to claim 1, wherein the shell is in one-piece form by bending a metal plate.

20. The heat-dissipating device according to claim 19, wherein a bottom of an inner surface of the chamber of the shell is formed with an inclined plane from a side away from the through hole and tilted toward the through hole, and the inclined plane is in one-piece form from bending of shell.

21. The heat-dissipating device according to claim 19, wherein the shell further includes two oblique plates and an inclined plane, the inclined plane is formed on a bottom of an inner surface of the chamber from a side away from the through hole and tilted toward the through hole, and the two oblique plates are disposed on two sides of the chamber of the shell and neighboring the stepped area to form the inclined plane.