CHIP CARD DEVICE AND METHOD FOR MANUFACTURE THEREOF

• US 20150129662A1
• Filed: 05/21/2013
• Published: 05/14/2015
• Est. Priority Date: 05/18/2012
• Status: Abandoned Application

• Current Assignee: Louis Rinze Henricus Adrianus Willemsen
• Original Assignee: Louis Rinze Henricus Adrianus Willemsen
• Inventors: Willemsen, Louis Rinze Henricus Adrianus
• Application Number:
  US14/400,899
• Publication Number:
  US 20150129662A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/07726 the record comprising means for indicating first use, e.g. a frangible layer
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: H01L 21/02 Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A chip card device including a card-like carrier having received therein a semiconductor substrate in the form of a chip, the semiconductor substrate including at least a memory element and is provided with contact surfaces which are accessible on the surface of the card-like carrier to enable reading of the memory element therewith. The card-like carrier including a linear fold line configured for placing, on or close to a card part including the contact surfaces, a further card part situated on the side of the fold line remote from the card part.

Claims

1. A chip card device comprising a card-like carrier having received therein a semiconductor substrate in the form of a chip of a Subscriber Identity Module (SIM), wherein the chip comprises at least a memory element and is provided with contact surfaces that are accessible on the surface of the card-like carrier to enable reading of the memory element therewith, wherein the chip of the SIM is further releasable from the card-like carrier for use of the chip of the SIM, wherein the card-like carrier comprises a card part with the chip of the SIM and a further card part adjoining the card part via a fold line such that the further card part is foldable onto the semiconductor substrate of the card part, wherein at least one of the sides of the card part and the further card part, which sides are foldable onto each other, is provided with personal user information associated with the SIM such that the other of the card part and the further card part covers the personal user information when the card part and the further card part are folded onto each other.

2. The chip card device according to claim 1, wherein the card part and the further card part are provided with fixing means for holding the chip card device in a folded state.

3. The chip card device according to claim 2, wherein the fixing means is breakable only once from a closed state.

4. The chip card device according to claim 3, wherein indicator means are provided that are configured to show when the packaging has been opened.

5. The chip card device according to claim 2, wherein the fixing means comprises one or more ultrasonic spot-welds.

6. The chip card device according to claim 2, wherein the fixing means comprises a hook element provided near an outer end of the card-like carrier, and a recess provided near an outer end of the card-like carrier opposite the outer end.

7. The chip card device according to claim 1, wherein the card part has a dimension in a direction perpendicularly of the fold line that is substantially equal to a dimension of the further card part in the same direction.

8. The chip card device according to claim 1, wherein the card part has a dimension in a direction parallel to the fold line that differs from a dimension of the further card part in the same direction.

9. The chip card device according to claim 1, wherein the linear fold line is formed by a recess in the card-like carrier.

10. The chip card device according to claim 1, wherein the fold line is formed by ultrasonic welding.

11. The chip card device according to claim 1, wherein the fold line defines a whole side of the card part or the further card part.

12. The chip card device according to claim 1, wherein the chip of the SIM received in the card part is irreversibly releasable from the carrier.

13. The chip card device according to claim 12, wherein the card part comprises a window opening in which the chip of the SIM is received.

14. The chip card device according to claim 1, wherein a recess is provided in at least one of the card part and the further card part.

15. (canceled)

16. (canceled)

17. A method for manufacturing a chip card device, comprising the steps of:

providing a first card part on which a semiconductor substrate in the form of a chip of a Subscriber Indentity Module (SIM) is placed;

providing a second card part;

connecting the first and second card parts via a fold line such that the second card part is foldable onto the semiconductor substrate of the first card part; and

providing at least one of the first and second card parts with personal user information associated with the SIM.