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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

  • US 20150130041A1
  • Filed: 11/06/2014
  • Published: 05/14/2015
  • Est. Priority Date: 11/08/2013
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor package, the method comprising:

  • stacking a lower semiconductor chip on a lower package substrate;

    forming a lower molding layer on the lower package substrate;

    forming a connecting through-hole and an element through-hole by performing a laser drilling process on the lower molding layer; and

    stacking an upper package substrate having a bottom surface to which a passive element is bonded on the lower package substrate to insert the passive element into the element through-hole.

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