HIGH VOLTAGE POWER CHIP MODULE

• US 20150131236A1
• Filed: 10/17/2014
• Published: 05/14/2015
• Est. Priority Date: 10/17/2013
• Status: Active Grant

• Current Assignee: Wolfspeed, Inc.
• Original Assignee: Arkansas Power Electronics International, Inc. (Wolfspeed, Inc.)
• Inventors: McPherson, Brice, Passmore, Brandon, Cole, Zachary
• Granted Patent: US 10,080,301 B2
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 25/00 Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereofdevices consisting of a plurality of solid state components formed in or on a common substrate H01L27/00; photovoltaic modules or arrays of photovoltaic cells H01L31/042 ; panels or arrays of photo electrochemical cells H01G9/2068
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14339 specially adapted for high voltage operation

Abstract

A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.

Claims

1. A power die module apparatus, comprising:

a baseplate;

sidewalls mounted to the base plate;

a power substrate mounted inside the side walls;

a printed circuit board positioned above the power substrate; and

at least one high voltage power die compressively held between and electrically contacting the power substrate and the printed circuit board.

2. The apparatus of claim 1, wherein the at least one high voltage power die is a silicon carbide power die.

3. The apparatus of claim 1, further comprising:

threaded inserts mounted to the power substrate;

the printed circuit board defining bolt apertures; and

bolts passing through the bolt apertures and into the threaded inserts.

4. A high voltage power die module apparatus, comprising:

a baseplate;

sidewalls mounted to the base plate;

a power substrate mounted inside the side walls;

a printed circuit board positioned above the power substrate;

at least one high voltage power die positioned between and electrically contacting the power substrate and the printed circuit board;

blade connectors extending upward from the printed circuit board; and

a lid defining at least one blade aperture surrounded by a corona extender.

5. A high voltage low parasitic loss power die module apparatus, comprising:

a baseplate;

at last one sidewall mounted to the base plate, the sidewall having a perimeter including at least one corona extender;

a power substrate mounted inside the side walls;

a printed circuit board positioned above the power substrate;

at least one high voltage power die positioned between and electrically contacting the power substrate and the printed circuit board.

6. The apparatus of claim 5, further comprising:

at least one blade connector extending upward from the printed circuit board; and

a lid defining at least one blade aperture surrounded by a corona extender.