POLISHING PAD AND METHOD FOR MANUFACTURING SAME

• US 20150133039A1
• Filed: 02/12/2013
• Published: 05/14/2015
• Est. Priority Date: 05/23/2012
• Status: Abandoned Application

• Current Assignee: KPX Chemical Co., Ltd., Samsung Electronics Co. Ltd.
• Original Assignee: KPX Chemical Co., Ltd., Samsung Electronics Co. Ltd.
• Inventors: Ahn, Bong-Su, Jeong, Jin-Su, Song, Kee-Cheon, Kim, Seung-Geun, Jang, Young-Jun, Lee, Sang-Mok, Seo, Jang-Won, Choo, Jeong-Seon, Kang, Hak-Su, Kong, Gyoung-Pyo
• Application Number:
  US14/397,542
• Publication Number:
  US 20150133039A1
• Time in Patent Office: Days
• US Class Current: 451/526
• CPC Class Codes: B24B 37/24 characterised by the composition or properties of the pad materials
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24D 11/001 Manufacture of flexible abrasive materials
• CPC Class Codes: B24D 11/003 without embedded abrasive particles B24D11/005 takes precedence
• CPC Class Codes: B24D 18/00 Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Abstract

Polishing pad and method of manufacturing the same, the method, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method including: grinding organic materials by using a physical method so as to form micro-organic particles; mixing the micro-organic particles formed in the operation with the materials for forming the polishing layer; mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in the operation so as to form gaseous pores; performing gelling and hardening of the mixture generated in the operation so as to form a polishing layer; and processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.

Claims

1. A method of manufacturing a polishing pad, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method comprising:

(a) grinding organic materials by using a physical method so as to form micro-organic particles;

(b) mixing the micro-organic particles formed in (a) with the materials for forming the polishing layer;

(c) mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in (b) so as to form gaseous pores;

(d) performing gelling and hardening of the mixture generated in (c) so as to form a polishing layer; and

(e) processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.

3. The method of claim 1, wherein the micro-organic particles comprise at least one selected from the group consisting of polyethylene resin, polypropylene resin, polystyrene resin, polyvinylchloride resin, polyamide resin, acryl resin, polyurethane resin, polycarbonate resin, phenyol resin, amino resin, epoxy resin, urea resin, polyester resin, rubber acrylonitrile butadiene styrene copolymer (ABS), and styrene acrylonitrile copolymer (SAN).

4. The method of claim 1, wherein the inert gas is selected from the group consisting of 8 group elements of a periodic table and gas that does not react with the materials for forming the polishing layer.

5. The method of claim 1, further comprising including liquid materials that constitute liquid microelements in the polishing layer in the materials for forming the polishing layer.

2. A method of manufacturing a polishing pad, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method comprising:

(a) including monomers for forming micro-organic particles in the materials for forming a polishing layer and forming and dispersing the micro-organic particles by polymerization of the monomers after stirring is performed;

(b) mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in (a) so as to form gaseous pores;

(c) performing gelling and hardening of the mixture generated in (b) so as to form a polishing layer; and

(d) processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.

10. The method of claim 2, wherein the micro-organic particles comprise at least one selected from the group consisting of polyethylene resin, polypropylene resin, polystyrene resin, polyvinylchloride resin, polyamide resin, acryl resin, polyurethane resin, polycarbonate resin, phenyol resin, amino resin, epoxy resin, urea resin, polyester resin, rubber acrylonitrile butadiene styrene copolymer (ABS), and styrene acrylonitrile copolymer (SAN).

11. The method of claim 2, wherein the inert gas is selected from the group consisting of 8 group elements of a periodic table and gas that does not react with the materials for forming the polishing layer.

12. The method of claim 2, further comprising including liquid materials that constitute liquid microelements in the polishing layer in the materials for forming the polishing layer.

6. A polishing pad that performs a polishing process by moving in contact with a surface of an object to be polished, the polishing pad comprising a polishing layer,

wherein the polishing layer comprises at least one of micro-organic particles formed by physically grinding organic materials and micro-organic particles formed by chemical polymerization of monomers and gaseous pores formed by at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical agent, and

open pores that are defined by opening the gaseous pores are distributed on a surface of the polishing layer.

7. The polishing pad of claim 6, wherein the micro-organic particles comprise at least one selected from the group consisting of polyethylene resin, polypropylene resin, polystyrene resin, polyvinylchloride resin, polyamide resin, acryl resin, polyurethane resin, polycarbonate resin, phenyol resin, amino resin, epoxy resin, urea resin, polyester resin, rubber acrylonitrile butadiene styrene copolymer (ABS), and styrene acrylonitrile copolymer (SAN).

8. The polishing pad of claim 6, wherein the inert gas is selected from the group consisting of 8 group elements of a periodic table and gas that does not react with the materials for forming the polishing layer.

9. The polishing pad of claim 6, wherein the polishing layer comprises liquid micro elements that are formed in a predetermined region of the polishing layer.

13. The polishing pad of claim 7, wherein the inert gas is selected from the group consisting of 8 group elements of a periodic table and gas that does not react with the materials for forming the polishing layer.

14. The polishing pad of claim 7, wherein the polishing layer comprises liquid microelements that are formed in a predetermined region of the polishing layer.