METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS

• US 20150135525A1
• Filed: 11/14/2014
• Published: 05/21/2015
• Est. Priority Date: 06/08/2011
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: Semprius, Inc.
• Inventors: Bower, Christopher
• Granted Patent: US 9,307,652 B2
• Time in Patent Office: Days
• US Class Current: 29/831
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/11002 for supporting the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13013 being rectangular or square
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29026 : relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/75312 : Material
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/7698 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/8114 : Guiding structures outside the body
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81395 : having an external coating, e.g. protective bond-through coating
• CPC Class Codes: H01L 2224/81411 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81901 : Pressing the bump connector against the bonding areas by means of another connector
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 : Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/04 : the devices not having separate containers
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1205 : Capacitor
• CPC Class Codes: H01L 2924/1304 : Transistor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: Y10T 156/1039 : Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active components on the second pillars thereof against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.

Claims

1. (canceled)

2. A method for transferring a plurality of active components from a source substrate to a destination substrate, the method comprising:

providing a source substrate having a process side including the plurality active components therein or thereon, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces;

pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; and

after pressing the first stamp against the plurality of active components, transferring the plurality of active components to a receiving surface of a destination substrate utilizing a second stamp having second pillars protruding therefrom, wherein each active component includes a component substrate different from the destination substrate, wherein transferring the plurality of active components to the receiving surface comprises;

pressing the second stamp against a destination substrate to adhere the plurality of active components to a receiving surface of the destination substrate; and

removing the second stamp from the receiving surface of the destination, thereby transferring the active components to the destination substrate and forming a display.

3. The method of claim 2, wherein the second stamp transfers the active components from the first stamp to the destination substrate.

4. The method of claim 2, wherein the plurality of active components comprises a plurality of integrated circuits.

5. The method of claim 2, wherein the receiving surface comprises an adhesive layer.

6. The method of claim 5, wherein the adhesive layer is a curable adhesive layer.

7. The method of claim 2, wherein transferring the plurality of active components to the receiving surface comprises:

pressing the second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars.

8. The method of claim 7, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars.

9. The method of claim 2, wherein pressing the second stamp against the destination substrate adheres the respective primary surfaces of the plurality of active components to the receiving surface of the destination substrate.

10. A method for transferring a plurality of active components from a source substrate to a destination substrate, the method comprising:

providing a source substrate having a process side including the plurality active components therein or thereon, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces;

pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; and

after pressing the first stamp against the plurality of active components, transferring the plurality of active components to a receiving surface of a destination substrate utilizing a second stamp having second pillars protruding therefrom, wherein transferring the plurality of active components to the receiving surface comprises;

pressing the second stamp against a destination substrate to adhere the plurality of active components to a receiving surface of the destination substrate.

11. The method of claim 10, wherein the second stamp transfers the active components from the first stamp to the destination substrate.

12. The method of claim 10, wherein the plurality of active components comprises a plurality of integrated circuits.

13. The method of claim 10, wherein transferring the plurality of active components to the receiving surface comprises:

removing the second stamp from the receiving surface of the destination, thereby transferring the active components to the destination substrate and forming a display.

14. The method of claim 10, wherein the receiving surface comprises an adhesive layer.

15. The method of claim 14, wherein the adhesive layer is a curable adhesive layer.

16. The method of claim 10, wherein the first stamp has more first pillars than the second stamp has second pillars.

17. The method of claim 10, wherein each active component includes a component substrate different from the destination substrate.

18. The method of claim 10, wherein transferring the plurality of active components to the receiving surface comprises:

pressing the second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars.

19. The method of claim 10, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars.

20. The method of claim 10, wherein pressing the second stamp against the destination substrate adheres the respective primary surfaces of the plurality of active components to the receiving surface of the destination substrate.

21. The method of claim 10, wherein the respective surfaces of the second pillars have a greater surface area than the respective surfaces of the first pillars.