POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONTAINING SUBSTRATE FOR FLEXIBLE SOLAR CELL, FLEXIBLE SOLAR CELL, AND METHOD FOR PRODUCING SAME

• US 20150136209A1
• Filed: 05/14/2013
• Published: 05/21/2015
• Est. Priority Date: 05/14/2012
• Status: Abandoned Application

• Current Assignee: Nippon Steel & Sumikin Chemical Co., Ltd. (Nippon Steel Corporation)
• Original Assignee: Nippon Steel & Sumikin Chemical Co., Ltd. (Nippon Steel Corporation)
• Inventors: Hiraishi, Katsufumi, Terashima, Shinichi, Suda, Hideaki, Kurosaki, Masao, Tanaka, Masamoto, Nagasaki, Shuji, Mizuyama, Atsushi, Hattori, Kouichi, Ohta, Takuhei
• Application Number:
  US14/400,720
• Publication Number:
  US 20150136209A1
• Time in Patent Office: Days
• US Class Current: 136/252
• CPC Class Codes: B32B 15/012 one layer being formed of an iron alloy or steel, another layer being formed of aluminium or an aluminium alloy
• CPC Class Codes: B32B 15/013 one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
• CPC Class Codes: B32B 15/015 the said other metal being copper or nickel or an alloy thereof
• CPC Class Codes: C08G 73/1042 Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• CPC Class Codes: C08G 73/105 with oxygen only in the diamino moiety
• CPC Class Codes: C08G 73/1067 Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
• CPC Class Codes: C08G 73/1071 Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C22C 38/001 containing N
• CPC Class Codes: C22C 38/002 containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
• CPC Class Codes: C22C 38/004 Very low carbon steels, i.e. having a carbon content of less than 0,01%
• CPC Class Codes: C22C 38/02 containing silicon
• CPC Class Codes: C22C 38/04 containing manganese
• CPC Class Codes: C22C 38/06 containing aluminium
• CPC Class Codes: C22C 38/12 containing tungsten, tantalum, molybdenum, vanadium, or niobium
• CPC Class Codes: C22C 38/14 containing titanium or zirconium
• CPC Class Codes: H01L 31/03926 comprising a flexible substrate
• CPC Class Codes: H01L 31/03928 including AIBIIICVI compound, e.g. CIS, CIGS deposited on metal or polymer foils
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H01L 31/1884 Manufacture of transparent electrodes, e.g. TCO, ITO
• CPC Class Codes: Y02E 10/541 : CuInSe2 material PV cells
• CPC Class Codes: Y02E 10/542 : Dye sensitized solar cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A flexible substrate has heat resistance to endure the high temperature such as sintering of a photovoltaic conversion layer of a compound-type thin film solar cell, can prevent permeation and/or diffusion of metal into the photovoltaic conversion layer, and can be used for many applications. The polyimide layer-containing flexible substrate has a metal substrate of metal foil made of ordinary steel or stainless steel having a coefficient of thermal expansion in a plane direction of not more than 15 ppm/K, or a metal substrate of metal foil made of that ordinary steel or stainless steel on the surface of which a metal layer comprising one of copper, nickel, zinc, or aluminum or an alloy layer of the same is provided, over which a polyimide layer having a layer thickness of 1.5 to 100 μm and a glass transition point temperature of 300 to 450° C. is formed.

Claims

1-15. -15. (canceled)

16. A polyimide layer-containing flexible substrate comprising:

a metal substrate of metal foil made of ordinary steel or stainless steel having a coefficient of thermal expansion in a plane direction of not more than 15 ppm/K and

a polyimide layer which is formed on the metal substrate, has a layer thickness of 1.5 to 100 μ

m, and has a glass transition point temperature of 300 to 450°

C.

19. The polyimide layer-containing flexible substrate according to claim 16, wherein the coefficient of thermal expansion in the plane direction of the polyimide layer at 100°

C. to 250°

C. is 15×

10<sup>−

6</sup>/K or less.

20. The polyimide layer-containing flexible substrate according to claim 16, wherein a surface roughness of the surface of the polyimide layer on the side which does not contact the metal substrate is 10 nm or less.

21. The polyimide layer-containing flexible substrate according to claim 16, wherein after heat treatment at 400°

C. for 10 minutes, the content of the metal which forms the metal substrate on the surface of the polyimide layer on the side which does not contact the metal substrate is less than a detection limit in measurement according to an emission spectrum detection method.

22. A substrate for a polyimide layer-containing flexible solar cell configured by using a polyimide layer-containing flexible substrate according to claim 16.

23. A flexible solar cell comprising:

a substrate for a polyimide layer-containing flexible solar cell according to claim 22,

a bottom electrode which is formed on the polyimide layer,

a photovoltaic conversion layer which is formed on the bottom electrode, and

a transparent electrode which is formed on the photovoltaic conversion layer.

24. The flexible solar cell according to claim 23, wherein, in the photovoltaic conversion layer, the content of the metal which forms the metal substrate is less than a detection limit in measurement according to an emission spectrum detection method.

25. The flexible solar cell according to claim 23, wherein the content of the metal which forms the metal substrate in the surface of the polyimide layer on the side which does not contact the metal substrate is less than a detection limit in measurement according to the emission spectrum detection method.

31. The polyimide layer-containing flexible substrate according to claim 16, wherein said polyimide layer is comprised of a reaction product of a tetracarboxylic acid compound and diamino compound and said tetracarboxylic acid compound is a structure represented by O(CO)₂AR₁(CO)₂O, where Ar₁ is selected from a tetravalent aromatic group represented by the following chemical formula (2):

32. The polyimide layer-containing flexible substrate according to claim 31, wherein said tetracarboxylic acid compound is selected from pyromellitic dianhydride (PMDA), 3,3′

,4,4′

-biphenyl tetracarboxylic acid dianhydride (BPDA), 3,3′

4,4′

-benzophenone tetracarboxylic acid dianhydride (BTDA), 3,3′

4,4′

-diphenylsulfone tetracarboxylic acid dianhydride (DSDA), and 4,4′

-oxidiphthalic dianhydride (ODPA).

33. The polyimide layer-containing flexible substrate according to claim 31, wherein said tetracarboxylic acid compound is selected from pyromellitic dianhydride (PMDA) and 3,3′

,4,4′

-biphenyl tetracarboxylic acid dianhydride (BPDA).

34. The polyimide layer-containing flexible substrate according to claim 16, wherein said polyimide layer is comprised of a reaction product of a tetracarboxylic acid compound and diamino compound and said diamino compound is a structure represented by NH₂—

Ar₂—

NH₂, where Ar₂ is selected from a tetravalent aromatic group represented by the following chemical formula (3);

35. The polyimide layer-containing flexible substrate according to claim 34, wherein said diamino compound is selected from diaminodiphenylether (DAPE), 2′

-methoxy-4,4′

-diaminobenzanilide (MABA), 2,2′

-dimethyl-4,4′

-diaminobiphenyl (m-TB), paraphenylenediamine (P-PDA), 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,3-bis(3-aminophenoxy)benzene (APB), 1,4-bis(4-aminophenoxy)benzene (TPE-Q), and 2,2-bis[4-(4-aminophenoxyl)phenyl]propane (BAPP).

36. The polyimide layer-containing flexible substrate according to claim 34, wherein said diamino compound is selected from 2,2′

-dimethyl-4,4′

-diaminobiphenyl (m-TB) and 2,2-bis[4-(4-aminophenoxyl)phenyl]propane (BAPP).

17. A polyimide layer-containing flexible substrate comprising:

a metal substrate of metal foil made of ordinary steel or stainless steel having a coefficient of thermal expansion in a plane direction of not more than 15 ppm/K on the surface of which a metal layer comprising one of copper, nickel, zinc, or aluminum or an alloy layer of the same is provided and

a polyimide layer which is formed on the metal layer or the alloy layer, has a layer thickness of 1.5 to 100 μ

m, and has a glass transition point temperature of 300 to 450°

C.

18. The polyimide layer-containing flexible substrate according to claim 17, wherein the metal layer or the alloy layer is an aluminum layer or aluminum alloy layer.

26. A method of production of a polyimide layer-containing flexible substrate comprising:

a step of coating a polyimide precursor solution on a metal substrate of metal foil made of ordinary steel or stainless steel having a coefficient of thermal expansion in a plane direction of not more than 15 ppm/K and

a step of heat treating the polyimide precursor solution to cure it by drying and imidization and forming a polyimide layer having a layer thickness of 1.5 to 100 μ

m and having a glass transition point temperature of 300 to 450°

C.

29. A method of production of a substrate for a polyimide layer-containing flexible solar cell which uses the method of production of a polyimide layer-containing flexible substrate according to claim 26 to produce a substrate for a polyimide layer-containing flexible solar cell which uses that polyimide layer-containing flexible substrate.

30. A method of production of a flexible solar cell comprising:

a step of forming a bottom electrode on a polyimide layer of a substrate for a polyimide layer-containing flexible solar cell which is produced according to the method of production of the substrate for a polyimide layer-containing flexible solar cell according to claim 29,

a step of forming a photovoltaic conversion layer on the bottom electrode, and

a step of forming a transparent electrode on the photovoltaic conversion layer.

27. A method of production of a polyimide layer-containing flexible substrate comprising:

a step of forming on the surface of metal foil made of ordinary steel or stainless steel having a coefficient of thermal expansion in a plane direction of not more than 15 ppm/K a metal layer comprising one of copper, nickel, zinc, or aluminum or an alloy layer of the same to form a metal substrate,

a step of coating a polyimide precursor solution on the metal layer or the alloy layer of the same, and

a step of heat treating the polyimide precursor solution to cause curing by drying and imidization and thereby to form a polyimide layer having a layer thickness of 1.5 to 100 μ

m and glass transition point temperature of 300 to 450°

C.

28. The method of production of a polyimide layer-containing flexible substrate according to claim 27 which forms an aluminum layer or aluminum alloy layer as the metal layer or the alloy layer in the step of forming on the surface of the metal foil the metal layer or alloy layer of the same to form the metal substrate.