MULTILAYER WIRING BOARD
First Claim
Patent Images
1. A multilayer wiring board comprising:
- a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer;
a prepreg disposed on the strip line of the core material; and
a second ground pattern disposed on the prepreg,wherein the insulating layer of the core material is configured to include a high frequency-adaptive base material, and the prepreg is configured to include a general-purpose base material.
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Accused Products
Abstract
A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.
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Citations
10 Claims
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1. A multilayer wiring board comprising:
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a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer; a prepreg disposed on the strip line of the core material; and a second ground pattern disposed on the prepreg, wherein the insulating layer of the core material is configured to include a high frequency-adaptive base material, and the prepreg is configured to include a general-purpose base material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification