MECHANISMS FOR FORMING MICRO-ELECTRO MECHANICAL SYSTEM DEVICE
First Claim
1. A micro-electro mechanical system (MEMS) device, comprising:
- a CMOS substrate;
a cap substrate;
a MEMS substrate bonded between the CMOS substrate and the cap substrate, wherein the MEMS substrate comprises at least one first movable element and at least one second movable element;
a first closed chamber between the MEMS substrate and the cap substrate, wherein the first movable element is in the first closed chamber; and
a second closed chamber between the MEMS substrate and the cap substrate, wherein the second movable element is in the second closed chamber, and a first pressure of the first closed chamber is higher than a second pressure of the second closed chamber.
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Accused Products
Abstract
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a CMOS substrate, a cap substrate, and a MEMS substrate bonded between the CMOS substrate and the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first closed chamber and a second closed chamber, which are between the MEMS substrate and the cap substrate. The first movable element is in the first closed chamber, and the second movable element is in the second closed chamber. A first pressure of the first closed chamber is higher than a second pressure of the second closed chamber.
9 Citations
20 Claims
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1. A micro-electro mechanical system (MEMS) device, comprising:
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a CMOS substrate; a cap substrate; a MEMS substrate bonded between the CMOS substrate and the cap substrate, wherein the MEMS substrate comprises at least one first movable element and at least one second movable element; a first closed chamber between the MEMS substrate and the cap substrate, wherein the first movable element is in the first closed chamber; and a second closed chamber between the MEMS substrate and the cap substrate, wherein the second movable element is in the second closed chamber, and a first pressure of the first closed chamber is higher than a second pressure of the second closed chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A micro-electro mechanical system (MEMS) device, comprising:
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a CMOS substrate; a first cap substrate; a second cap substrate bonded with the first cap substrate; a MEMS substrate bonded between the CMOS substrate and the first cap substrate, wherein the MEMS substrate comprises at least one first movable element and at least one second movable element, and the first cap substrate is between the second cap substrate and the MEMS substrate; a first closed chamber between the MEMS substrate and the second cap substrate, wherein the first movable element is in the first closed chamber; and a second closed chamber between the MEMS substrate and the first cap substrate, wherein the second movable element is in the second closed chamber, and a first pressure of the first closed chamber is higher than a second pressure of the second closed chamber. - View Dependent Claims (12, 13, 14, 15)
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16. A method for forming a micro-electro mechanical system (MEMS) device, comprising:
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forming a dielectric layer over a semiconductor substrate; bonding the dielectric layer with a carrier substrate; patterning the semiconductor substrate into a plurality of elements; partially removing the dielectric layer to release some of the elements such that the released elements become at least one first movable element and at least one second movable element; bonding a cap substrate with the semiconductor substrate to form a first closed chamber and a second closed chamber between the semiconductor substrate and the cap substrate; bonding a CMOS substrate with the carrier substrate; removing a portion of the cap substrate to open the second closed chamber; and vacuumizing and sealing the second closed chamber such that the second closed chamber has a second pressure after the second closed chamber is open, wherein a first pressure of the first closed chamber is higher than the second pressure, and the first movable element and the second movable element are in the first closed chamber and the second closed chamber, respectively. - View Dependent Claims (17, 18, 19, 20)
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Specification