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SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER

  • US 20150137345A1
  • Filed: 10/01/2014
  • Published: 05/21/2015
  • Est. Priority Date: 11/21/2013
  • Status: Abandoned Application
First Claim
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1. A semiconductor package comprising:

  • a substrate;

    a first semiconductor chip disposed on the substrate;

    a second semiconductor chip disposed on the first semiconductor chip;

    a heat spreader disposed above the first semiconductor chip; and

    a thermal interfacial material (TIM) layer being in contact with the first semiconductor chip and the heat spreader, the TIM layer further covering one or more side surfaces of the second semiconductor chip.

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