SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER
First Claim
1. A semiconductor package comprising:
- a substrate;
a first semiconductor chip disposed on the substrate;
a second semiconductor chip disposed on the first semiconductor chip;
a heat spreader disposed above the first semiconductor chip; and
a thermal interfacial material (TIM) layer being in contact with the first semiconductor chip and the heat spreader, the TIM layer further covering one or more side surfaces of the second semiconductor chip.
1 Assignment
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Accused Products
Abstract
A semiconductor package includes a heat spreader. The semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on the first semiconductor chip. The heat spreader may be formed on the first semiconductor chip. A thermal interfacial material (TIM) layer may be formed to be in contact with the first semiconductor chip and the heat spreader and may cover side surfaces of the second semiconductor chip. Heat generated by the first semiconductor chip may be emitted through the TIM layer and the heat spreader. Thermal stress caused by a difference in coefficients of thermal expansion (CTEs) between the substrate and the first semiconductor chip may be distributed to ensure structural stability.
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Citations
20 Claims
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1. A semiconductor package comprising:
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a substrate; a first semiconductor chip disposed on the substrate; a second semiconductor chip disposed on the first semiconductor chip; a heat spreader disposed above the first semiconductor chip; and a thermal interfacial material (TIM) layer being in contact with the first semiconductor chip and the heat spreader, the TIM layer further covering one or more side surfaces of the second semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor package comprising:
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a first semiconductor chip; a second semiconductor chip arranged on the first semiconductor chip; and a heat spreader arranged above the first semiconductor chip and configured to cover top and side surfaces of the second semiconductor chip, wherein a bottom surface of the heat spreader is arranged at a level lower than a bottom surface of the second semiconductor chip. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A semiconductor package comprising:
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a substrate; a first semiconductor chip arranged on the substrate; a second semiconductor chip arranged on the first semiconductor chip; a heat spreader covering a top and side surfaces of the second semiconductor chip; and a thermal interface material (TIM) arranged between the heat spreader and the second semiconductor chip. - View Dependent Claims (17, 18, 19, 20)
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Specification