THREE AXIS MAGNETIC SENSOR DEVICE AND METHOD USING FLEX CABLES
First Claim
1. A device for sensing magnetic fields, the device comprising:
- a first substrate member having a first surface region and a second surface region;
a first integrated circuit (IC) layer spatially disposed overlying at least a portion of the first surface region of the first substrate member, the first IC layer having one or more bond pads;
a first magnetic field sensor element operably coupled to the first IC layer, the first magnetic field sensor element being configured to sense magnetic fields in a first spatial direction;
a second magnetic field sensor element operably coupled to the first IC layer, the second magnetic field sensing element being configured to sense magnetic fields in a second direction;
a second substrate member coupled to the first substrate member, the second substrate member having a first surface region and a second surface region, the second surface region of the second substrate member being coupled to the second surface region of the first substrate member;
a second IC layer spatially disposed overlying at least a portion of the first surface region of the second substrate member, the second IC layer having one or more bond pads;
a third magnetic field sensor element operably coupled to the second IC layer, the third magnetic sensing element being configured to sense magnetic fields in a third spatial direction; and
one or more conductive elements electrically coupling the first IC layer and the second IC layer, the one or more conductive elements being coupled to the bond pad of the first IC layer and the bond pad of the second IC layer.
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Accused Products
Abstract
A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.
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Citations
16 Claims
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1. A device for sensing magnetic fields, the device comprising:
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a first substrate member having a first surface region and a second surface region; a first integrated circuit (IC) layer spatially disposed overlying at least a portion of the first surface region of the first substrate member, the first IC layer having one or more bond pads; a first magnetic field sensor element operably coupled to the first IC layer, the first magnetic field sensor element being configured to sense magnetic fields in a first spatial direction; a second magnetic field sensor element operably coupled to the first IC layer, the second magnetic field sensing element being configured to sense magnetic fields in a second direction; a second substrate member coupled to the first substrate member, the second substrate member having a first surface region and a second surface region, the second surface region of the second substrate member being coupled to the second surface region of the first substrate member; a second IC layer spatially disposed overlying at least a portion of the first surface region of the second substrate member, the second IC layer having one or more bond pads; a third magnetic field sensor element operably coupled to the second IC layer, the third magnetic sensing element being configured to sense magnetic fields in a third spatial direction; and one or more conductive elements electrically coupling the first IC layer and the second IC layer, the one or more conductive elements being coupled to the bond pad of the first IC layer and the bond pad of the second IC layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device for sensing magnetic fields, the device comprising:
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a substrate member having a first surface region and a second surface region; a first insulation material spatially disposed overlying the first surface region of the substrate, the first insulation material having a surface region; a first integrated circuit (IC) layer spatially disposed overlying at least a portion of the surface region of the first insulation material, the first IC layer having one or more bond pads; a first magnetic field sensor element operably coupled to the first IC layer, the first magnetic field sensor element being configured to detect at least in a first direction; a second magnetic field sensor element operably coupled to the first IC layer, the second magnetic field sensing element being configured to detect at least in a second direction. a second insulation material coupled the substrate member, the second insulation material having a first surface region and a second surface region, the second surface region of the second insulation material being coupled to the second surface region of the substrate member; a second IC layer spatially disposed overlying at least a portion of the first surface region of the second insulator material, the second IC layer having one or more bond pads; a third magnetic field sensor element operably coupled to the second IC layer, the third magnetic sensing element being configured to detect at least in a third direction; and one or more conductive cables electrically coupling the first IC layer and the second IC layer, the one or more conductive cables being coupled to at least one of the bond pad(s) of the first IC layer and at least one of the bond pad(s) from the second IC layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification