FLEXIBLE SUBSTRATES FOR WEARABLE DEVICES

• US 20150138700A1
• Filed: 11/13/2014
• Published: 05/21/2015
• Est. Priority Date: 11/13/2013
• Status: Abandoned Application

• Current Assignee: JB IP Acquisitions LLC
• Original Assignee: AliphCom, Inc. (AliphCom Corp.)
• Inventors: Goyal, Dileep, Chakravarthula, Hari N., Ionescu, Mihai
• Application Number:
  US14/541,064
• Publication Number:
  US 20150138700A1
• Time in Patent Office: Days
• US Class Current: 361/679.03
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: H04M 1/0277 for a printed circuit board assembly
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, a flexible substrate. In one example, a wearable device may include a framework configured to be worn or attached, and a flexible substrate coupled to the framework. The flexible substrate may include a first end and a second end, and may include one or more conductive layer structures and a conductive laminate structure. The flexible substrate may include rigid regions configured to receive one or more components including a sensor, an electrode, and/or a logic circuit (e.g., bioimpedance logic circuit).

Claims

1. A wearable device comprising:

a framework configured to be worn or attached; and

a flexible substrate coupled to the framework, the flexible substrate having a first end and a second end and comprising;

one or more conductive layer structures;

a conductive laminate structure; and

a plurality of intermediate support structures,

wherein the flexible substrate includes one or more rigid regions configured to receive one or more components including a sensor.

2. The wearable device of claim 1 wherein at least a rigid region of the rigid regions comprises:

a portion of the one or more conductive layer structures, a portion of the conductive laminate structure, and a portion of the plurality of intermediate support structures,

wherein the portions are stacked upon each other.

3. The wearable device of claim 1 wherein the rigid regions comprise:

at least one of the sensor, a vibratory motor, and an electronic device.

4. The wearable device of claim 1 wherein the flexible substrate further comprises:

at least two intermediate support structures of the plurality of the intermediate support structures in which the conductive laminate structure is disposed between the two intermediate support structures.

5. The wearable device of claim 1 wherein the flexible substrate further comprises:

one or more supported flex regions.

6. The wearable device of claim 5 wherein the one or more supported flex regions each comprises:

at least two intermediate support structures of the plurality of the intermediate support structures disposed between a first rigid region and a second rigid region.

7. The wearable device of claim 6 wherein each of the two intermediate support structures comprises:

two intermediate layers.

8. The wearable device of claim 7 wherein each of the two intermediate layers comprises:

a polyimide layer.

9. The wearable device of claim 1 wherein the flexible substrate further comprises:

one or more flex regions.

10. The wearable device of claim 9 wherein the one or more flex regions each comprises:

at least two intermediate support structures of the plurality of the intermediate support structures disposed between a third rigid region and one of the first or the second ends.

11. The wearable device of claim 10 wherein each of the two intermediate support structures comprises:

one intermediate layer.

12. The wearable device of claim 1 wherein at least one of the rigid regions comprises:

a molding material encapsulating one of the components.

13. The wearable device of claim 12 wherein the molding material comprises:

an extension portion that encapsulates a portion of a supported flex region.

14. The wearable device of claim 13 wherein extension portion comprises:

a ridge supporting the portion of a supported flex region.

15. The wearable device of claim 1 wherein the flexible substrate comprises:

electrodes.

16. The wearable device of claim 1 wherein a rigid region comprises:

a logic circuit.

17. The wearable device of claim 1 wherein the sensor comprises:

electrodes;

one or more of the conductive layer structures; and

a bioimpedance logic circuit.

18. A method comprising:

forming a flexible substrate including;

one or more conductive layer structures;

a conductive laminate structure; and

a plurality of intermediate support structures;

coupling the flexible substrate to a framework; and

molding over the flexible substrate and the framework,

wherein the flexible substrate includes one or more rigid regions configured to receive one or more components including a sensor.

19. The method of claim 18, further comprising:

disposing the conductive laminate structure between multiple intermediate layers, each of which is a constituent of at least one of plurality of intermediate support structures.

20. The method of claim 18, further comprising:

molding over a component in a rigid region; and

extending a molding material to form a ridge contacting a surface portion of a supported flex region.