HEAT DISSIPATION PIPE LOOP AND BACKLIGHT MODULE USING SAME

• US 20150138830A1
• Filed: 11/28/2013
• Published: 05/21/2015
• Est. Priority Date: 11/19/2013
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Yu, Gang
• Granted Patent: US 9,366,484 B2
• Time in Patent Office: Days
• US Class Current: 362/609
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0055 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/1336 Illuminating devices
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

The present invention provides a heat dissipation pipe loop and a backlight module using the heat dissipation pipe loop. The heat dissipation pipe loop includes: a first evaporator section (2), a second evaporator section (4) arranged opposite to the first evaporator section (2), a first pipe (6), a second pipe (8) arranged opposite to the first pipe (6), and a heat dissipation liquid arranged in the first pipe (6) and the second pipe (8). The first pipe (6) includes a first gas pipe (62) connected to the first evaporator section (2), a first condenser pipe (64) connected to the first gas pipe (62), and a first liquid pipe (66) connected to the first condenser pipe (64) and the second evaporator section (4). The second pipe (8) includes a second gas pipe (82) connected to the second evaporator section (4), a second condenser pipe (84) connected to the second gas pipe (82), and a second liquid pipe (86) connected to the second condenser pipe (84) and the first evaporator section (2).

Claims

1. A heat dissipation pipe loop, comprising:

a first evaporator section, a second evaporator section arranged opposite to the first evaporator section, a first pipe connected to the first evaporator section and the second evaporator section, a second pipe connected to the first evaporator section and the second evaporator section and arranged opposite to the first pipe and a heat dissipation liquid arranged in the first pipe and the second pipe, the first evaporator section, the first pipe, the second evaporator section, and the second pipe being sequentially connected in a tail end to leading end manner so as to form a closed loop, the first pipe comprising a first gas pipe connected to the first evaporator section, a first condenser pipe connected to the first gas pipe, and a first liquid pipe connected to the first condenser pipe and the second evaporator section, the second pipe comprising a second gas pipe connected to the second evaporator section, a second condenser pipe connected to the second gas pipe, and a second liquid pipe connected to the second condenser pipe and the first evaporator section.

2. The heat dissipation pipe loop as claimed in claim 1, wherein the first evaporator section comprises a first compensation chamber adjacent to the second liquid pipe, a first liquid chamber arranged frontward of the first compensation chamber, a first stop plate arranged frontward of the first liquid chamber, a first capillary body mounted on the first stop plate, a first gas passage arranged above the first capillary body, and a first heat transfer layer arranged above the first gas passage and the second evaporator section comprises a second compensation chamber adjacent to the first liquid pipe, a second liquid chamber arranged frontward of the second compensation chamber, a second stop plate arranged frontward of the second liquid chamber, a second capillary body mounted on the second stop plate, a second gas passage arranged above the second capillary body, and a second heat transfer layer arranged above the second gas passage.

3. The heat dissipation pipe loop as claimed in claim 1, wherein the heat dissipation liquid is composed of water, Freon refrigerant, ammonia, and methanol.

4. The heat dissipation pipe loop as claimed in claim 1, wherein the first pipe and the second pipe are made of at least one of copper and titanium.

5. A backlight module that uses a heat dissipation pipe loop, comprising:

a backplane, a light guide plate mounted in the backplane, two backlight sources mounted in the backplane, a heat dissipation pipe loop arranged between the backplane and the backlight sources, and a reflector plate arranged between the backplane and the light guide plate, the heat dissipation pipe loop comprising;

a first evaporator section, a second evaporator section arranged opposite to the first evaporator section, a first pipe connected to the first evaporator section and the second evaporator section, a second pipe connected to the first evaporator section and the second evaporator section and arranged opposite to the first pipe and a heat dissipation liquid arranged in the first pipe and the second pipe, the first evaporator section, the first pipe, the second evaporator section, and the second pipe being sequentially connected in a tail end to leading end manner so as to form a closed loop, the first pipe comprising a first gas pipe connected to the first evaporator section, a first condenser pipe connected to the first gas pipe, and a first liquid pipe connected to the first condenser pipe and the second evaporator section, the second pipe comprising a second gas pipe connected to the second evaporator section, a second condenser pipe connected to the second gas pipe, and a second liquid pipe connected to the second condenser pipe and the first evaporator section, the two backlight sources being respectively arranged on the first evaporator section and the second evaporator section.

6. The backlight module that uses the heat dissipation pipe loop as claimed in claim 5, wherein the first evaporator section comprises a first compensation chamber adjacent to the second liquid pipe, a first liquid chamber arranged frontward of the first compensation chamber, a first stop plate arranged frontward of the first liquid chamber, a first capillary body mounted on the first stop plate, a first gas passage arranged above the first capillary body, and a first heat transfer layer arranged above the first gas passage and the second evaporator section comprises a second compensation chamber adjacent to the first liquid pipe, a second liquid chamber arranged frontward of the second compensation chamber, a second stop plate arranged frontward of the second liquid chamber, a second capillary body mounted on the second stop plate, a second gas passage arranged above the second capillary body, and a second heat transfer layer arranged above the second gas passage.

7. The backlight module that uses the heat dissipation pipe loop as claimed in claim 6, wherein each of the backlight sources comprises a printed circuit board and a plurality of LED (Light-Emitting Diode) lights mounted to and electrically connected with the printed circuit board, the two printed circuit boards of the two backlight sources being respectively and directly positioned against the first heat transfer layer and the second heat transfer layer.

8. The backlight module that uses the heat dissipation pipe loop as claimed in claim 5, wherein the heat dissipation liquid is composed of water, Freon refrigerant, ammonia, and methanol.

9. The backlight module that uses the heat dissipation pipe loop as claimed in claim 5, wherein the first pipe and the second pipe are made of at least one of copper and titanium.

10. The backlight module that uses the heat dissipation pipe loop as claimed in claim 7, wherein the backplane comprises a bottom board and a plurality of side boards perpendicularly connected to the bottom board, the bottom board comprising a first bottom board section and two second bottom board sections that are arranged to each show a stepped connection with the first bottom board section, the printed circuit boards and the first evaporator section and the second evaporator section of the heat dissipation pipe loop being arranged on the second bottom board sections, upper surfaces of the printed circuit boards being substantially flush with an upper surface of the first bottom board section.

11. A backlight module that uses a heat dissipation pipe loop, comprising:

a backplane, a light guide plate mounted in the backplane, two backlight sources mounted in the backplane, a heat dissipation pipe loop arranged between the backplane and the backlight sources, and a reflector plate arranged between the backplane and the light guide plate, the heat dissipation pipe loop comprising;

a first evaporator section, a second evaporator section arranged opposite to the first evaporator section, a first pipe connected to the first evaporator section and the second evaporator section, a second pipe connected to the first evaporator section and the second evaporator section and arranged opposite to the first pipe band a heat dissipation liquid arranged in the first pipe and the second pipe, the first evaporator section, the first pipe, the second evaporator section, and the second pipe being sequentially connected in a tail end to leading end manner so as to form a closed loop, the first pipe comprising a first gas pipe connected to the first evaporator section, a first condenser pipe connected to the first gas pipe, and a first liquid pipe connected to the first condenser pipe and the second evaporator section, the second pipe comprising a second gas pipe connected to the second evaporator section, a second condenser pipe connected to the second gas pipe, and a second liquid pipe connected to the second condenser pipe and the first evaporator section, the two backlight sources being respectively arranged on the first evaporator section and the second evaporator section;

wherein the first evaporator section comprises a first compensation chamber adjacent to the second liquid pipe, a first liquid chamber arranged frontward of the first compensation chamber, a first stop plate arranged frontward of the first liquid chamber, a first capillary body mounted on the first stop plate, a first gas passage arranged above the first capillary body, and a first heat transfer layer arranged above the first gas passage and the second evaporator section comprises a second compensation chamber adjacent to the first liquid pipe, a second liquid chamber arranged frontward of the second compensation chamber, a second stop plate arranged frontward of the second liquid chamber, a second capillary body mounted on the second stop plate, a second gas passage arranged above the second capillary body, and a second heat transfer layer arranged above the second gas passage.

12. The backlight module that uses the heat dissipation pipe loop as claimed in claim 11, wherein each of the backlight sources comprises a printed circuit board and a plurality of LED (Light-Emitting Diode) lights mounted to and electrically connected with the printed circuit board, the two printed circuit boards of the two backlight sources being respectively and directly positioned against the first heat transfer layer and the second heat transfer layer.

13. The backlight module that uses the heat dissipation pipe loop as claimed in claim 11, wherein the heat dissipation liquid is composed of water, Freon refrigerant, ammonia, and methanol.

14. The backlight module that uses the heat dissipation pipe loop as claimed in claim 11, wherein the first pipe and the second pipe are made of at least one of copper and titanium.

15. The backlight module that uses the heat dissipation pipe loop as claimed in claim 12, wherein the backplane comprises a bottom board and a plurality of side boards perpendicularly connected to the bottom board, the bottom board comprising a first bottom board section and two second bottom board sections that are arranged to each show a stepped connection with the first bottom board section, the printed circuit boards and the first evaporator section and the second evaporator section of the heat dissipation pipe loop being arranged on the second bottom board sections, upper surfaces of the printed circuit boards being substantially flush with an upper surface of the first bottom board section.