SYSTEM AND METHOD FOR DISTRIBUTED THERMAL MONITORING

• US 20150139272A1
• Filed: 11/17/2014
• Published: 05/21/2015
• Est. Priority Date: 11/15/2013
• Status: Abandoned Application

• Current Assignee: Canara Incorporated (Capitol Power Group LLC)
• Original Assignee: Canara Incorporated (Capitol Power Group LLC)
• Inventors: Hanking, Brian, Cotton, Stephen D., Carmel, Michael, Yu, Tony, Sheppard, Douglas
• Application Number:
  US14/543,617
• Publication Number:
  US 20150139272A1
• Time in Patent Office: Days
• US Class Current: 374/121
• CPC Class Codes: G01J 5/0066 for hot spots detection
• CPC Class Codes: G01J 5/0096 for measuring wires, electrical contacts or electronic systems
• CPC Class Codes: G01J 5/025 Interfacing a pyrometer to an external device or network; User interface
• CPC Class Codes: G01J 5/0896 using a light source, e.g. for illuminating a surface

Abstract

Implementations of the present disclosure involve a thermal monitoring system that includes multiple thermal sensor nodes and a control node. The thermal sensor nodes include an infrared sensor, an ambient temperature sensor, at least one LED, and a controller with a memory for storing temperature measurements and a sending and receiving information to and from the control node. The control node for receives, stores, and outputs temperature measurements from at least one thermal sensor node.

Claims

1. A thermal monitoring system comprising:

a control node having a processor and a memory, the control node in communication with at least one thermal sensor node, wherein the memory stores instructions causing the processor to retrieve a temperature information from the at least one thermal sensor node, wherein each thermal sensor node comprises;

an infrared sensor for measuring a temperature of a component;

an ambient temperature sensor for measuring an ambient temperature; and

a controller configured to obtain the temperature information comprising at least one of the temperature of the component, the ambient temperature, and a temperature differential between the temperature of the component and the ambient temperature, and store the temperature information in a memory.

3. The thermal monitoring system of claim 1, wherein the control node compares the temperature information to a temperature threshold and generates an alert when the temperature threshold is exceeded.

4. The thermal monitoring system of claim 1, wherein the instructions are further configured to cause the processor to automatically assign a logical address to a new thermal sensor node by:

sending a command to a default logical address of the new thermal sensor node;

receiving a reply from the new thermal sensor node acknowledging receipt of the command; and

assigning the new thermal sensor an available logical address upon acknowledging receipt of the command.

5. The thermal monitoring system of claim 1, wherein the instructions are further configured to cause the control node to send the temperature information to a server, wherein the server updates a database of information including the temperature information received from the control node.

6. The thermal monitoring system of claim 5, wherein the control node is configured to store the logical address of each thermal sensor node and the database is configured to also store a location information corresponding to the logical address for each thermal sensor node and the location of the corresponding component.

7. The thermal monitoring system of claim 1, wherein each thermal sensor node comprises a light emitting diode indicating the temperature of the device.

8. The thermal monitoring system of claim 7, wherein the at least one light emitting diode comprises a tri-color light emitting diode configured to:

emit a first color when the temperature differential meets a first threshold;

emit a second color when the temperature differential is within the first threshold and a second threshold; and

emit a third color when the temperature differential meets the second threshold.

9. The thermal monitoring system of claim 7, wherein the at least one light emitting diode is positioned on the thermal sensor node so that when aligning the infrared sensor to measure the temperature of the component, the light emitting diode is activated and emits light on an area that substantially corresponds to a viewing angle of the infrared sensor.

10. The thermal monitoring system of claim 1, wherein each thermal sensor node further comprises a mounting assembly comprising a clamping mechanism configured to secure the thermal sensor node so that the infrared sensor measures the temperature of the component.

2. The thermal monitoring system of claim wherein the infrared sensor includes an infrared matrix sensor for measuring temperatures of a plurality of components.

11. A thermal monitoring system comprising:

a control node having a processor and a memory, the control node in communication with a plurality of thermal sensor nodes, wherein the memory stores instructions causing the processor to retrieve a temperature information from the thermal sensor nodes, wherein each thermal sensor node comprises;

an infrared sensor mounted on a housing, the infrared sensor for measuring a temperature of a device at a location within a field of view of the sensor;

a controller in communication with the infrared sensor, the controller comparing the temperature of the device with a threshold to identify when the temperature exceeds the threshold; and

a mounting assembly operably coupled to the housing.

12. The thermal monitoring system of claim 11, wherein each thermal sensor node further comprises:

an ambient temperature sensor for measuring an ambient temperature; and

a light emitting diode illuminating based on a temperature differential between the temperature of the device and the ambient temperature.

13. The thermal monitoring system of claim 12, wherein the control node compares the temperature to the ambient temperature to obtain the temperature differential and generates an alert when the temperature differential meets a threshold.

14. The thermal monitoring system of claim 11, wherein the instructions are further configured to cause the processor to automatically assign a logical address to a newly added thermal sensor node by:

sending a command to a default logical address of the newly added thermal sensor node;

receiving a reply from the newly added thermal sensor node indicating receipt of the command; and

assigning the newly added thermal sensor an available logical address.

15. The thermal monitoring system of claim 11, wherein the instructions are further configured to cause the control node to send the temperature information to a server, wherein the server updates a database of temperature information for the device at the location.

16. The thermal monitoring system of claim 15, wherein the control node is configured to store the logical address of each thermal sensor node and the database is configured to also store a location information corresponding to the logical address for each thermal sensor node, wherein the location information describes at least one of the location or the component that the thermal sensor node is measuring the temperature of.

17. The thermal monitoring system of claim 12, wherein the light emitting diode comprises a tri-color diode configured to:

emit a first color when the temperature differential meets a first threshold;

emit a second color when the temperature differential is between the first threshold and a second threshold; and

emit a third color when the temperature differential meets the second threshold.

18. The thermal monitoring system of claim 12, wherein the diode is positioned on a housing of the thermal sensor node so that when aligning the infrared sensor to measure the temperature the component, the light emitting diode is activated and emits light on an area that substantially corresponds to the field of view of the infrared sensor.

19. The thermal monitoring system of claim 11 wherein the infrared sensor includes an infrared matrix sensor mounted on a housing, the infrared matrix sensor for measuring a plurality of temperatures of a plurality of devices at a location within a field of view of the sensor.

21. The method of claim 19 further comprising:

transmitting the device temperature, the ambient temperature, and the timestamps to a remote server;

the remote server configured to allow a display of the device temperature, ambient temperature, and timestamp using a graphical user interface and provide an alert when a device temperature meets a threshold.

22. The method of claim 18, further comprising illuminating a light emitting diode according to a difference between the device temperature and the ambient temperature.

23. The method of claim 18, further comprising automatically assigning a logical address to a new thermal sensor node with a default logical address by:

sending an instruction to the default logical address;

recognizing a reply from the new thermal sensor node with the default logical address; and

assigning the new thermal sensor an available logical address.

20. A method of monitoring temperatures across multiple locations comprising:

measuring a device temperature using an infrared sensor operating on a thermal sensor node;

measuring an ambient temperature using an ambient temperature sensor operating on the thermal sensor node;

storing the device temperature, the ambient temperature, and a timestamp in a memory of the thermal sensor node; and

sending a set of device temperatures, ambient temperatures, and timestamps to a control node from the thermal sensor node.