ELECTRO/MECHANICAL MICROCHIPS AND METHOD OF MAKING WITH BURST ULTRAFAST LASER PULSES

• US 20150140735A1
• Filed: 11/12/2014
• Published: 05/21/2015
• Est. Priority Date: 11/19/2013
• Status: Active Grant

• Current Assignee: Rofin-Sinar Technologies LLC (Coherent Corp.)
• Original Assignee: Rofin-Sinar Technologies Incorporated (Coherent Corp.)
• Inventors: HOSSEINI, S. ABBAS
• Granted Patent: US 9,517,929 B2
• Time in Patent Office: Days
• US Class Current: 438/107
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/0626 Energy control of the laser beam B23K26/0622 takes precedence
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/356 by shock processing
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00634 Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: C03B 33/0222 Scoring using a focussed radiation beam, e.g. laser
• CPC Class Codes: C03B 33/04 Cutting or splitting in curves, especially for making spectacle lenses
• CPC Class Codes: H01L 25/043 Stacked arrangements of devices
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.

Claims

1. A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:

machining full or partial voids on said first transparent substrate using photoacoustic compression; and

,

affixing said first transparent substrate and said second transparent substrate together.

2. A method for making an electromechanical chip using a first transparent substrate, comprising the steps of:

machining a first void on a first side of said first transparent substrate using photoacoustic compression;

machining a second void on a second side of said first transparent substrate using photoacoustic compression;

applying an electrically conductive material in said void on said first side of said first transparent substrate; and

,

applying an electrically conductive material in said void on a second side of said first transparent substrate.

3. A method for making an electromechanical chip using a first transparent substrate, as claimed in claim 2, further comprising the steps of:

said first void is a partial void and does not extend through said first transparent substrate; and

,

said second void is a partial void and does not extend through said second transparent substrate.

4. A method for making an electromechanical chip using a first transparent substrate, as claimed in claim 2, further comprising the steps of:

said first void is a complete void and extends completely through said first transparent substrate;

said second void is a complete void and extends through said second transparent substrate; and

,

said first and second voids are in electrical communication.

5. A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:

machining full or partial voids in said first transparent substrate using photoacoustic compression;

machining full or partial voids in said second transparent substrate using photoacoustic compression;

placing said first and second transparent substrates in engagement with one another such that said full or partial voids of said first transparent substrate communicate with said full or partial voids of said second transparent.

6. A method for making an electromechanical chip, comprises the following steps:

providing a transparent material;

providing a laser beam comprising a burst of laser pulses;

providing a laser beam delivery system capable of focusing said laser beam with respect to said transparent material and to enable relative movement between said laser beam and said transparent material;

focusing said laser beam relative to the transparent material to form a beam waist at a location that is external to the transparent material, wherein said laser pulses incident on the surface of said transparent material are focused such that sufficient energy density is maintained within said transparent material to form a continuous laser filament therethrough without causing optical breakdown;

propagating an orifice about said filament that traverses completely through a section of transparent material by photoacoustic compression; and

,

machining a mounting structure, a trough, a channel, slice, or cut through said transparent material.

7. A method for making an electromechanical chip as claimed in claim 6, wherein said transparent material is silicon.

8. A method for making an electromechanical chip as claimed in claim 6, wherein said transparent material is glass.

9. A method for making an electromechanical chip as claimed in claim 6, wherein said photoacoustic compression does not remove any transparent material from said chip.

10. A method for making an electromechanical chip as claimed in claim 6, wherein said burst of pulses includes between 1-50 pulses.

11. A method for making an electromechanical chip as claimed in claim 6, further comprising the step of:

mounting a mechanical device within said mounting structure, a trough, a channel, a slice, or a cut through said transparent material.

12. A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of:

machining, using photoacoustic compression, full or partial voids in at least one of said plurality of substrates;

stacking said plurality of transparent substrates in a specific order;

affixing said substrates together.

13. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 12, comprising the steps of:

sealing said chip by laser welding said transparent substrates together.

14. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 12, wherein said plurality of transparent substrates include varying thicknesses.

15. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 12, wherein said step of stacking said plurality of transparent substrates includes aligning said full or partial voids in at least two said transparent substrates.

16. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 12, further comprising the steps of:

injecting a gas, liquid or solid into one of said full or partial voids in said at least one of said plurality of substrates, and then sealing said plurality of substrates together.

17. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 16, wherein said step of sealing is performed with a laser.

18. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 16, wherein said step of sealing is performed with an adhesive.

19. A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of:

machining, using photoacoustic compression, full or partial voids in at least two of said plurality of substrates;

stacking said plurality of machined transparent substrates in a specific order and formatting said electromechanical chip as a device selected from the group of electrodes, wires, electrical and mechanical conduits, electrical and mechanical sensors, transistors, TTL circuits, logic circuits, capacitors, diodes, Zener diodes, Schottky diodes, linear and switching power supplies, power supply circuits including bridge circuits, chemical and biological analytic circuits, microfluidic channels, microfluidic controls and other microelectronics; and

,

affixing said substrates together.

20. A method for making an electromechanical chip using a plurality of transparent substrates as claimed in claim 19, wherein said step of sealing is performed with a laser.