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ELECTRO/MECHANICAL MICROCHIPS AND METHOD OF MAKING WITH BURST ULTRAFAST LASER PULSES

  • US 20150140735A1
  • Filed: 11/12/2014
  • Published: 05/21/2015
  • Est. Priority Date: 11/19/2013
  • Status: Active Grant
First Claim
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1. A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:

  • machining full or partial voids on said first transparent substrate using photoacoustic compression; and

    ,affixing said first transparent substrate and said second transparent substrate together.

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