×

METHODS FOR FABRICATING HIGH-DENSITY INTEGRATED CIRCUIT DEVICES

  • US 20150143306A1
  • Filed: 12/29/2014
  • Published: 05/21/2015
  • Est. Priority Date: 05/05/2011
  • Status: Active Grant
First Claim
Patent Images

1. An article of manufacture comprising:

  • a machine readable data storage medium storing in a non-transitory manner a design entry for an integrated circuit device, the design entry including;

    a mask layer specifying a mask element having a single edge for fabricating an entire plurality of lines of a second material to be grown epitaxially on a first material layer within trenches at locations defined by successive formation against the single edge of first sidewall spacers alternating with second sidewall spacers and removal of the first sidewall spacers; and

    a layout comprising the plurality of lines of the second material.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×