DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS

• US 20150145116A1
• Filed: 04/10/2014
• Published: 05/28/2015
• Est. Priority Date: 11/22/2013
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Uzoh, Cyprian Emeka, Katkar, Rajesh
• Granted Patent: US 9,379,074 B2
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/1718 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81825 Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/06506 : Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06589 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/10 : Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.

Claims

1. An apparatus, comprising:

a substrate;

a first bond via array with first wires each of a first length extending from a first surface of the substrate;

an array of bump interconnects disposed on the first surface;

a die interconnected to the substrate via the array of bump interconnects;

a second bond via array with second wires each of a second length different than the first length extending from a second surface of the die.

2. The apparatus according to claim 1, wherein the second bond via array is disposed interior to the first bond via array and the first length is greater than the second length.

3. The apparatus according to claim 1, wherein the array of bump interconnects is disposed within the first bond via array.

4. The apparatus according to claim 1, wherein:

the die is a first die;

the second length is less than the first length for coupling a second die and a third die to the first bond via array and the second bond via array; and

the second die and the third die each partially extend over the first die.

5. The apparatus according to claim 2, further comprising:

a heat sink covering the first die, the second die, and the third die; and

a thermal paste disposed to couple an upper surface of each of the first die, the second die, and the third die to an interior surface of the heat sink.

6. The apparatus according to claim 1, wherein the substrate is an interposer.

7. An apparatus, comprising:

a substrate;

a bond via array with first wires extending from a first surface of the substrate;

a first array of bump interconnects disposed on the first surface;

a first die interconnected to the substrate via the first array of bump interconnects;

a second array of bump interconnects disposed on a second surface of the first die;

wherein the first wires of the first bond via array are of a length; and

wherein the second array of bump interconnects are of a height less than the length for coupling a second die and a third die to the bond via array and the second array of bump interconnects.

8. The apparatus according to claim 7, wherein the second die and the third die each partially extend over the first die.

9. The apparatus according to claim 7, wherein the second array of bump interconnects is disposed interior to the bond via array.

10. The apparatus according to claim 7, wherein the first array of bump interconnects is disposed within the bond via array.

11. The apparatus according to claim 7, further comprising:

a heat sink covering the first die, the second die, and the third die; and

a thermal paste disposed to couple an upper surface of each of the first die, the second die, and the third die to an interior surface of the heat sink.

12. The apparatus according to claim 7, wherein the substrate is an interposer.

13. An apparatus, comprising:

an interposer;

a first bond via array with first wires extending from a first surface of the interposer;

a second bond via array with second wires extending from a second surface of the interposer, the second surface opposite the first surface;

a first array of bump interconnects disposed on the first surface;

a second array of bump interconnects disposed on the second surface;

a first die interconnected to the interposer via the first array of bump interconnects;

a second die interconnected to the interposer via the second array of bump interconnects;

a first interconnect array disposed on a surface of the first die opposite the surface of the first die facing the interposer;

a second interconnect array disposed on a surface of the second die opposite the surface of the second die facing the interposer;

wherein the first wires of the first bond via array are of a first length; and

wherein first interconnects of the first interconnect array are of a second length less than the first length, the first interconnects and the first wires couple a third die and a fourth die to the first bond via array and the first interconnect array.

14. The apparatus according to claim 13, wherein:

the second wires of the second bond via array are of the first length; and

second interconnects of the second interconnect array are of the second length for coupling a fifth die and a sixth die to the second bond via array and the second interconnect array.

15. The apparatus according to claim 14, wherein:

the third die and the fourth die each partially extend over the first die; and

the fifth die and the sixth die each partially extend under the second die.

16. The apparatus according to claim 15, wherein:

the first interconnect array is a third bond via array with third wires extending from the third surface of the first die;

the second interconnect array is a fourth bond via array with fourth wires extending from the fourth surface of the second die;

the third wires of the third bond via array are of the second length less than the first length for coupling the third die and the fourth die to the first bond via array and the third bond via array; and

wherein the fourth wires of the fourth bond via array are of the second length for coupling the fifth die and the sixth die to the second bond via array and the fourth bond via array.

17. The apparatus according to claim 15, wherein:

the first interconnect array is a third array of bump interconnects disposed on the third surface of the first die; and

the second interconnect array is a fourth array of bump interconnects disposed on the fourth surface of the second die.

18. The apparatus according to claim 15, further comprising:

a heat sink covering the first die, the second die, the third die, the fourth die, the fifth die, the sixth die, and the interposer; and

a thermal paste disposed on the first die, the second die, the third die, the fourth die, the fifth die, and the sixth die to couple an interior surface of the heat sink respectively thereto;

wherein the apparatus is a single packaged part.

19. The apparatus according to claim 13, further comprising:

a first wire of the first wires extending from a landing pad disposed on the first surface of the interposer; and

a second wire of the first wires extending from the landing pad and angled for interconnection with the first wire.

20. The apparatus according to claim 13, further comprising:

a first wire of the first wires extending from a first landing pad disposed on the first surface of the interposer; and

a second wire of the first wires extending from a second landing pad disposed on the first surface of the interposer and angled for interconnection with the first wire;

wherein the first wire and the second wire are of different lengths and are fused together; and

wherein the first wires have different lengths from one another.