DATA PROCESSING METHOD, DATA PROCESSING APPARATUS AND PROCESSING APPARATUS

• US 20150154145A1
• Filed: 07/31/2014
• Published: 06/04/2015
• Est. Priority Date: 11/29/2013
• Status: Active Grant

• Current Assignee: Hitachi High-Tech Company Limited (Hitachi, Ltd.), Sanofi-Aventis Deutschland GmbH (Sanofi )
• Original Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Inventors: INOUE, Satomi, NAKAMOTO, Shigeru, FUKUCHI, Kousuke, WATANABE, Seiichi
• Granted Patent: US 10,073,818 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 17/18 for evaluating statistical data , e.g. average values, frequency distributions, probability functions, regression analysis forecasting specially adapted for a specific administrative, business or logistic context G06Q10/04
• CPC Class Codes: H01J 37/32963 End-point detection
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.

Claims

1. A data processing apparatus comprising:

a data input/output device which is configured to receive data to be processed;

a storage which is configured to store the data received by the data input/output device;

a data processing program storage which is configured to store a data processing program that includes the steps of;

calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of a gradient of the smoothed data; and

calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of a gradient of the smoothed data; and

a data calculation processing apparatus which is configured to perform the data processing under the data processing program, wherein

the data input/output device outputs the first predicted value calculated by the data calculation processing apparatus as a result of a data smoothing process, the second predicted value calculated by the data calculation processing apparatus or the third predicted value calculated by the data calculation processing apparatus as a result of a first differential process, and the fourth predicted value calculated by the data calculation processing apparatus as a result of a second differential process, respectively.

2. A processing apparatus comprising:

a processing chamber to be a control object;

a measuring device which is configured to obtain data relating to the processing chamber;

a data calculation processing apparatus which is configured to perform data processing under a data processing program that includes the steps of;

calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of a gradient of the smoothed data; and

calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of a gradient of the smoothed data; and

a controller which is configured to detect a state of the processing chamber or a change in the state of the processing chamber on the basis of at least one of the first predicted value calculated by the data calculation processing apparatus, the second predicted value calculated by the data calculation processing apparatus, the third predicted value calculated by the data calculation processing apparatus, and the fourth predicted value calculated by the data calculation processing apparatus, and to control the processing chamber according to the detection result.

3. The processing apparatus according to claim 2, wherein

the processing chamber subjects a sample mounted on a sample stage to a plasma process.

4. A processing apparatus comprising:

a processing chamber to be a control object;

a measuring device which is configured to obtain data relating to the processing chamber;

a data calculation processing apparatus which is configured to perform data processing under a data processing program that uses a responsive double exponential smoothing method in which smoothing parameters are varied in accordance with an error between the data obtained by the measuring device and the predicted value of smoothed data, and that processes data while making a lower limit value of a variable range of the smoothing parameters greater than zero; and

a controller which is configured to detect a state of the processing chamber or a change in the state of the processing chamber on the basis of at least one of a result of a data smoothing process calculated by the data calculation processing apparatus, a result of a first differential process calculated by the data calculation processing apparatus, and a result of a second differential process calculated by the data calculation processing apparatus, and to control the processing chamber according to the detection result.

5. A processing apparatus comprising:

a processing chamber in which a sample mounted on a sample stage is subjected to a plasma process;

a measuring device which is configured to obtain light emission data in the plasma process of the sample;

a data calculation processing apparatus which is configured to perform data processing under a data processing program that uses a responsive double exponential smoothing method in which smoothing parameters are varied in accordance with an error between the data obtained by the measuring device and the predicted value of smoothed data, and that processes data while making a lower limit value of the variable range of the smoothing parameters greater than zero; and

a controller which is configured to detect a plasma processing state of the sample or a change in the plasma processing state of the sample on the basis of at least one of a result of a data smoothing process calculated by the data calculation processing apparatus, a result of a first differential process calculated by the data calculation processing apparatus, or a result of a second differential process calculated by the data calculation processing apparatus, and to control the processing chamber according to the detection result.