Counterbore Pocket Structure for Fluidic Assembly

• US 20150155445A1
• Filed: 10/31/2014
• Published: 06/04/2015
• Est. Priority Date: 12/27/2011
• Status: Abandoned Application

• Current Assignee: Elux Inc.
• Original Assignee: Sharp Laboratories of America Incorporated (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Zhan, Changqing, Crowder, Mark Albert, Schuele, Paul John
• Application Number:
  US14/530,230
• Publication Number:
  US 20150155445A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/0008 Processes
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/04 with a quantum effect structure or superlattice, e.g. tunnel junction
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/18 within the light emitting region
• CPC Class Codes: H01L 33/24 of the light emitting region, e.g. non-planar junction
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/42 : Transparent materials

Abstract

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

Claims

1. A fluidic assembly method using a counterbore pocket structure, the method comprising:

providing a substrate comprising a top surface and a bottom surface, with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface;

flowing an ink comprising a plurality of objects over the substrate top surface;

creating a suction pressure at the substrate bottom surface; and

,

in response to the suction pressure from the through-holes, drawing the objects into the counterbore pocket structures.

2. The method of claim 1 wherein flowing the ink over the substrate top surface includes flowing an ink comprising a plurality of objects in a shape of a disk.

3. The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a first diameter sliding fit to accommodate a disk diameter.

4. The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.

5. The method of claim 4 wherein providing the substrate includes providing the through-hole offset from the first diameter center, away from the second portion.

6. The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.

7. The method of claim 1 wherein flowing the ink over the substrate top surface includes:

arranging the substrate top surface with a substrate first side higher than a substrate second side;

introducing the ink to the substrate first side; and

,

wherein drawing disks into the counterbore pocket structures includes drawings the disks in response to gravity as well as suction pressure.

8. The method of claim 1 wherein providing the substrate includes providing a transparent substrate;

and,

wherein flowing the ink over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) in the shape of a disk over the substrate top surface.

9. A fluidic assembly substrate comprising:

a substrate comprising a top surface and a bottom surface;

a plurality of counterbore pocket structures formed in the substrate top surface; and

,

a through-hole formed between each counterbore pocket structure and the substrate bottom surface.

10. The fluidic assembly substrate of claim 9 wherein the substrate comprises:

a first layer with through-hole,s formed between a first layer top surface and a first layer bottom surface; and

,

a second layer with counterbore pocket structure formed between a second layer top surface and a second layer bottom surface.

11. The fluidic assembly substrate of claim 9 wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.

12. The fluidic assembly substrate of claim 11 wherein the through-hole is offset from the first diameter center, away from the second portion.

13. The fluidic assembly substrate of claim 9 wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.

14. The fluidic assembly substrate of claim 9 wherein the substrate is transparent.

15. A substrate assembly comprising:

a substrate comprising a top surface and a bottom surface;

a plurality of counterbore pocket structures formed in the substrate top surface;

a through-hole formed between each counterbore pocket structure and the substrate bottom surface; and

,

an object at least sliding fit positioned inside each counterbore pocket structure.

16. The substrate assembly of claim 15 wherein the objects are disks;

and,

wherein the counterbore pocket structures have a first diameter sliding fit to accommodate a disk diameter.

17. The substrate assembly of claim 15 wherein the objects are disks;

and,

wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.

18. The substrate assembly of claim 17 wherein the through-hole is offset from the first diameter center, away from the second portion.

19. The substrate assembly of claim 15 wherein the objects are disks;

and,

wherein the counterbore, pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.

20. The substrate assembly of claim 15 wherein the substrate is transparent;

and,

wherein the objects are light emitting diodes (LEDs) in the form of disks.